Industry News | 2016-05-05 20:48:30.0
KYZEN announces that it has been awarded the 2016 EM Asia Innovation Award in the category of Cleaning Materials for its AQUANOX® A8820 Advanced Aqueous Stencil Cleaner. The award was presented to the company on April 26, 2016 at the Shanghai World Expo Exhibition & Convention Center during NEPCON China.
Industry News | 2018-01-16 10:38:59.0
Gen3 Systems Limited, a specialist British manufacturer and distributor, is pleased to announce that it will exhibit on stands F35 and F60 at Southern Manufacturing, scheduled to take place February 6th – 8th at FIVE in Farnborough, Hampshire.
Industry News | 2017-03-07 09:28:32.0
Gen3 Systems Limited, a specialist British manufacturer and distributor, is pleased to announce that it will exhibit on stands J19 and J20 at Southern Manufacturing, scheduled to take place March 21st – 23rd at FIVE in Farnborough, Hampshire.
Industry News | 2022-01-25 08:46:41.0
Gen3 Systems Limited, a specialist British manufacturer and distributor, is pleased to announce that it will exhibit on stand L160 at Southern Manufacturing, scheduled to take place February 8th – 10th at FIVE in Farnborough, Hampshire.
Industry News | 2009-04-08 16:12:41.0
DENVER � April 2009 � Krayden, Inc., a leading distributor of engineered materials, introduces an updated and expanded line card, detailing its services and manufacturers.
Industry News | 2011-05-27 21:57:47.0
Traqu is a high-resolution digital 3-D inspection device from Essemtec used for 3-D measurement and analysis in processes such as solder paste inspection (SPI). Measurement tasks are programmed with a few mouse clicks, and DXF and Gerber data can be imported.
Industry News | 2021-06-23 06:30:58.0
Austin American Technology (AAT) is pleased to announce that it has successfully completed the installation of a Mega ION® SA at KYZEN's Applications Lab in Nashville, TN. The Mega ION SA is the perfect addition to KYZEN's Applications Lab for cleaning test requiring a semi-aqueous process. The Mega ION SA rinses with de-ionized water rather than using a solvent to both wash and rise.
Technical Library | 2019-08-07 22:56:45.0
The requirement to reconsider traditional soldering methods is becoming more relevant as the demand for bottom terminated components (QFN/BTC) increases. Thermal pads under said components are designed to enhance the thermal and electrical performance of the component and ultimately allow the component to run more efficiently. Additionally, low voiding is important in decreasing the current path of the circuit to maximize high speed and RF performances. The demand to develop smaller, more reliable, packages has seen voiding requirements decrease below 15 percent and in some instances, below 10 percent.Earlier work has demonstrated the use of micro-fluxed solder preforms as a mechanism to reduce voiding. The current work builds upon these results to focus on developing an engineered approach to void reduction in leadless components (QFN) through increasing understanding of how processing parameters and a use of custom designed micro-fluxed preforms interact. Leveraging the use of a micro-fluxed solder preform in conjunction with low voiding solder paste, stencil design, and application knowhow are critical factors in determining voiding in QFN packages. The study presented seeks to understand the vectors that can contribute to voiding such as PCB pad finish, reflow profile, reflow atmosphere, via configuration, and ultimately solder design.A collaboration between three companies consisting of solder materials supplier, a power semiconductor supplier, and an electronic assembly manufacturer worked together for an in-depth study into the effectiveness of solder preforms at reducing voiding under some of the most prevalent bottom terminated components packages. The effects of factors such as thermal pad size, finish on PCB, preform types, stencil design, reflow profile and atmosphere, have been evaluated using lead-free SAC305 low voiding solder paste and micro-fluxed preforms. Design and manufacturing rules developed from this work will be discussed.
Industry News | 2015-11-17 12:24:20.0
November 17, 2015 -- At last week’s Productronica event held in Munich, Germany, FCT Assembly was honored with a Global Technology Award for its new, VOC-free stencil coating, NanoSlic® (www.nanoslic.com). This award win comes on the heels of several successes for NanoSlic, including recent expansion of the company’s licensing network and increased use of the coating technology among global electronics manufacturing firms.
Industry News | 2013-02-20 08:38:42.0
FCT Assembly announces that it has been awarded a 2013 NPI Award in the category of Coatings/Encapsulants for its NanoSlic™ Nano Coating.
