Industry News | 2021-02-23 15:00:48.0
BTU International, Inc. today announced plans to exhibit at SEMICON China, scheduled to take place March 17-19, 2021 at the Shanghai New International Expo Centre. The PYRAMAX™ Vacuum Reflow Oven will be displayed in the CohPros booth, Hall E7 #7343.
Industry News | 2021-07-27 15:49:00.0
BTU International, Inc. today announced plans to exhibit at NEPCON South China, scheduled to take place Aug. 25-27, 2021 at the Shenzhen International Convention & Exhibition Center, booth number 1P45. BTU will showcase the new Valence 3508 selective soldering system and PYRAMAX™ Vacuum Reflow Oven.
Industry News | 2020-09-28 22:54:44.0
Compared with other international lithium battery standards, the temperature cycling conditions specified in the UN38.3 standard are more demanding and longer.
Industry News | 2017-11-29 14:28:56.0
Nordson MARCH announces its new-generation RollVIA™ plasma system, a completely self-contained vacuum plasma system with production-proven, roll-to-roll material handling for flexible printed circuit board (PCB) manufacturing. The new RollVIA incorporates unique vacuum and gas flow technology, new process control technology, updated electrode designs, and superior temperature management with precise control of roll speed, tension, and edge guidance for uniform plasma treatment of substrates as thin as 25 microns. The RollVIA system is used for plasma applications such as surface activation for improved adhesion, carbon removal and descum/desmear for cleaner surfaces, and etchback, which removes a slight amount of dielectric contamination between internal copper planes during production of PCBs.
Industry News | 2011-05-03 21:50:04.0
Automated Circuit Design (ACD) purchased a Trident QUAD High-Yield Automatic Defluxing and Cleanliness Testing System from Aqueous Technologies during the recent IPC APEX Expo in Las Vegas.
Industry News | 2018-07-26 18:26:42.0
Kolb AQUBE MV8sTWIN
Industry News | 2019-12-16 22:35:33.0
Vacuum reflow oven is to conduct high-quality welding for products in a vacuum environment to protect products and solder from being oxidized under the condition of vacuum, and to react the oxide of products and solder surface at the same time to improve the quality of welding surface and reduce the void rate of welding.
Industry News | 2011-09-21 13:44:27.0
KVM4S/EUROPE-SMT, a leading global supplier of SMT production solutions, announces that it has sold X-Treme Series’ Auto Dry Cabinet to the Polish division of electronics manufacturer Flextronics.
Industry News | 2016-05-13 11:56:03.0
The process of manufacturing and qualifying IC's consists of many steps while Temperature forcing systems play a crucial role in the final testing process. These environmental tests assure quality and reliability by stressing the device on one hand as well as helping to characterize and validate it on the other hand (making sure manufacturing outcome meets the design requirements). At later stages the temperature testing can support failure analysis effort and root cause analysis. AS common practice we are dealing with few different kinds of temperature forcing systems: Chambers, Thermal Stream systems and Direct Thermal Head systems. In this article I would like to focus on the practical aspects of utilizing Thermal Stream systems and Direct Thermal Head systems.
Industry News | 2016-05-13 12:00:12.0
The process of manufacturing and qualifying IC's consists of many steps while Temperature forcing systems play a crucial role in the final testing process. These environmental tests assure quality and reliability by stressing the device on one hand as well as helping to characterize and validate it on the other hand (making sure manufacturing outcome meets the design requirements). At later stages the temperature testing can support failure analysis effort and root cause analysis. AS common practice we are dealing with few different kinds of temperature forcing systems: Chambers, Thermal Stream systems and Direct Thermal Head systems. In this article I would like to focus on the practical aspects of utilizing Thermal Stream systems and Direct Thermal Head systems.
