Electronics Forum | Wed May 27 09:56:39 EDT 1998 | Chrys
| | | We recently made the switch to no-clean and the wurface mount is turning out beautifully. However, the wave solder process continues to put up a fight; we are getting a white residue on the surface of the PCB. The residue is not localize
Electronics Forum | Wed May 27 15:09:30 EDT 1998 | Dave F
| | | | We recently made the switch to no-clean and the wurface mount is turning out beautifully. However, the wave solder process continues to put up a fight; we are getting a white residue on the surface of the PCB. The residue is not locali
Electronics Forum | Fri May 15 18:26:06 EDT 1998 | Earl Moon
| | Hello. | | 1 Could anyone tell me the range of temperature | | to solder MI components? The process eng is using 400~500 | | degrees Celcius!! For standard 0805/0603 chips & TH components & | | also to touch up on ICs. What
Electronics Forum | Thu May 27 16:23:12 EDT 2004 | davef
Process Trials Procedures. Standard trials are often conducted on reflow ovens by production engineers during product assessment, machine approval or in process set-up. The following trials are also used by machine suppliers during equipment develop
Electronics Forum | Sun Apr 25 11:50:08 EDT 1999 | Earl Moon
| | | We are just starting to manufacture a PCB with a .039" fine-line PBGA. We are currently seeing voids, mainly in the center, that are as much as 45%. We also intermittently see the corner balls of the PBGA smaller than the center balls. We are u
Electronics Forum | Wed May 27 15:54:09 EDT 1998 | Chrys
| | | | | We recently made the switch to no-clean and the wurface mount is turning out beautifully. However, the wave solder process continues to put up a fight; we are getting a white residue on the surface of the PCB. The residue is not loca
Electronics Forum | Fri Oct 08 10:08:48 EDT 1999 | Glenn Robertson
| | | | I have a board, 4 spacers needed to be soldered on the board | | | | first with the normal 62Sn37Pb alloy. Then, capacitors are manually soldered on the boards. The density of the board is quite high. If we wave soldered capacitors first,
Electronics Forum | Thu Sep 16 12:06:29 EDT 1999 | Scott S. Snider
| | | Hi, | | | | | | Can someone pls suggest to me the best reflow temperature setting | | | for a force air convection oven. The details is as follow. | | | 1) Heller 1700s | | | 2) 12 zone---6 top and 6 bot | | | 3) Solder paste --- Qualitek 691
Electronics Forum | Mon Mar 08 20:17:41 EST 1999 | Michael Larsen
| | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | Concerning the BGA stuff, I'm getting about 60% success using
Electronics Forum | Tue Jul 28 09:15:49 EDT 1998 | Justin Medernach
| We are about to run our first BGA devices and would appreciate some confirmation on a few points. | First some details: | PCB & Device: | ============= | 1) 16 layer (4 power, 4 gnd, 8 signal) | 2) gold on nickel finish | 3) ceramic BGA with eutec
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