Electronics Forum: via and holes (Page 7 of 63)

Bigger particle size solder paste helps reduce via hole problem?

Electronics Forum | Thu Jun 02 06:23:08 EDT 2011 | alcatel

1 chip has 2 solder pads....and both pads definitely has solder.... im not getting what you are trying to say.

Bigger particle size solder paste helps reduce via hole problem?

Electronics Forum | Thu Jun 02 06:23:40 EDT 2011 | alcatel

1 chip has 2 solder pads....and both pads definitely has solder.... im not getting what you are trying to say.

tooling holes as a fiducials???? or others???Help needed!!!!

Electronics Forum | Fri Mar 24 06:08:54 EST 2006 | PhilJ

Try using via pads as fiducials. This will avoid the problem of drilling accuracy.

Dealing with BGA solder ball in via hole

Electronics Forum | Wed Mar 23 22:29:21 EDT 2011 | nkinar

I have a few prototype circuit boards with BGA footprints where some (but not all) of the vias have been placed too close to the pads. During reflow, some of the solder from the balls flowed into the holes. Only one of the pads under the BGA is not

Dealing with BGA solder ball in via hole

Electronics Forum | Thu Mar 24 16:06:34 EDT 2011 | nkinar

Thanks for the reply, davef. Due to prototyping time constraints, I've been asked by the engineers if I could do something on the SMT line to salvage this prototype PCB. Could I do anything to connect the pad or fill the via? Much of the board h

Bigger particle size solder paste helps reduce via hole problem?

Electronics Forum | Wed Jun 01 15:50:59 EDT 2011 | markhoch

I don't believe that particle size of the solderpaste will offer you any relief from this issue. The solder flows into the via, leeching away from the desired solderpoint, after the solder has become liquious. The chemical make-up of the solder contr

Bigger particle size solder paste helps reduce via hole problem?

Electronics Forum | Thu Jun 02 10:54:12 EDT 2011 | davef

Al: We agree with AVFOM. You have a different problem than solder paste mesh selection. Most often, tombstoning occurs when the wetting forces on the two pads are unequal. Examples of things that can cause this are: * Pads are different * Board pad

How to to merge PTH and NPTH holes to a single file

Electronics Forum | Wed Sep 05 21:51:32 EDT 2018 | cannizzaro

I was wondering when creating Gerber drill file from Kicad there is an option to merge PTH and NPTH holes to a single file. How should this value be selected? Since I'm planning to use the prototype service in ALLPCB, and the Gerber is needed

How to to merge PTH and NPTH holes to a single file

Electronics Forum | Thu Sep 06 05:23:14 EDT 2018 | netvicher123

In KiCad, in the dialog for generating drill files, there is a checkbox "Merge PTH and NPTH holes into one file."

solder pop out from via hole at secondary reflow

Electronics Forum | Mon Jul 08 14:41:17 EDT 2002 | davef

See what happens when you take a couple of days off? Your theory sounds reasonable, but someone else could make an equally valid case that you are blasting your solder plug across the room with the force of the expansion of entapped air between th


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