Electronics Forum: waves and soldering (Page 7 of 569)

Wave soldering

Electronics Forum | Sat Dec 10 07:54:32 EST 2005 | davef

Dan Terstegge's jump site is the BEST. Look here: http://www.smtinfo.net/Db/_Wave%20Soldering.html

wave soldering

Electronics Forum | Thu Jan 29 12:57:37 EST 2009 | wavemasterlarry

Only if it has exposed ends on the end.

HELP Abaut comparison of the SM988 and SAC 305 wave soldering

Electronics Forum | Tue Aug 22 09:57:15 EDT 2006 | picman

I must prepare formal report abaut comparison of the SM988 and SAC 305 wave soldering( as a .ppt file). May you help me please ?

BGA soldering

Electronics Forum | Tue Oct 28 17:40:58 EST 2003 | davef

We theorize a secondary [bottom] side BGA can be wave soldered with planning. Issues are: * Keepout between the BGA and one side of the board that is clear of PTH parts requiring wave soldering, so to support the fixture. * Keepout around the BGA. *

CSP and BGA soldering difference.

Electronics Forum | Fri Apr 06 08:32:47 EDT 2007 | davef

Haris: On your soldering issues, we don't know the make-up of your component. We don't know the type solder balls on the component. We don't know the solder paste you plan to use. Your component and paste supplier are better sources for this type o

CSP and BGA soldering difference.

Electronics Forum | Thu Apr 05 05:05:09 EDT 2007 | Haris

Still confused what you are trying to say? And I didnt get the answer regarding soldering profile.

Flip Chip and lead-free soldering

Electronics Forum | Thu Jul 20 16:08:18 EDT 2000 | Grant Baynham

Do you have any experience with flip chip applications using lead-free solder, and specifically do you have any information revealing how the process parameters for standard air reflow atmosphere can be modified to match the results for solder reflow

CSP and BGA soldering difference.

Electronics Forum | Mon Apr 02 01:24:52 EDT 2007 | Haris

Dear all, I want to know the difference between the CSP and the BGA (I think there is only in the mesh pin difference). Secondly, if their solder balls have same dia, LxBxH are also same with the the manufacturing of the pin coating chemical elemen

CSP and BGA soldering difference.

Electronics Forum | Fri Apr 06 08:45:48 EDT 2007 | davef

UNDERFILL The design of the component and the end-use environment drive the requirement fot underfill. Here is a good introduction: http://www.asymtek.com/news/articles/2002_globaltronics_csp_and_fcuf.pdf Google for more. We have no relationship, n

CSP and BGA soldering difference.

Electronics Forum | Sat Apr 07 00:41:35 EDT 2007 | Haris

Thank you all for giving me good knowledge.


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