Full Site - : what cause solder splash (Page 7 of 128)

Indium Corporation's Technology Experts to Present at SMTA/iNEMI

Industry News | 2013-11-05 22:51:20.0

Indium Corporation's Dr. Ning-Cheng Lee, Vice President of Technology, and Dr. Ron Lasky, Senior Technologist, will present at the SMTA/iNEMI Medical Electronics Symposium November 13-14 in Milpitas, California.

Indium Corporation

ECD Debuts Thermal Quality Management Program: ThQM

Industry News | 2009-04-13 15:02:37.0

ECD introduced its thermal quality management program, called ThQM, for OEMs and their volume manufacturers. It is designed to directly address the dialog required between OEMs and contract assemblers, including OEM requirements, machine recipe development, and thermal profile verification.

Electronic Controls Design Inc. (ECD)

Why use Via in Pad Design?

Industry News | 2019-11-05 22:08:21.0

Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it.

Headpcb

Kyzen Participates in Successful Technology Day with Respected Industry Experts

Industry News | 2011-06-20 19:27:48.0

Kyzen participated in the first of several upcoming Technology Days. The successful event took place Tuesday, June 14, 2011 at the Holiday Inn Pointe Claire in Pointe Claire, Quebec. Four great names in the industry came together to present “Process Considerations and Improvements.”

KYZEN Corporation

CyberOptics Brings the Multifunction SQ3000™ for AOI, SPI and CMM to NEPCON China

Industry News | 2019-03-25 19:40:08.0

CyberOptics® will exhibit at NEPCON China, scheduled to take place April 24-26, 2019 at the Shanghai World Expo Exhibition and Convention Center. The company will demonstrate the MRS-Enabled 3D SQ3000 with multi-process capabilities including 3D AOI, SPI and CMM applications in Booth # 1E52 and 1E54.

CyberOptics Corporation

Saki introduces its new 3Di Automated Optical Inspection System

Saki introduces its new 3Di Automated Optical Inspection System

Videos

The new system delivers high-speed (5,700mm2/sec), high-accuracy (XY positioning of 3µm at 3?), height repeatability (below 2µm at 3?), and scalable resolutions of 7, 12 and 18µm for boards weighing 12kg. http://www.sakiglobal.com/automated-optical-i

SAKI America

The necessity of X-ray inspection for SMT BGA soldering quality control

Industry News | 2021-06-10 02:42:13.0

With the advent of 5G, especially the high integration, high density, miniaturization of packaging, and high process requirements in the electronics industry, detection efficiency is particularly important. Many manufacturers are not particularly clear about what role X-Ray can play and how to use X-Ray to improve the process and reduce the defect rate. Most manufacturers buy X-Ray because of the needs of customers. Those who are forced to buy X-Ray alone do not actually understand the important role that X-Ray can play in the production line.

Unicomp Technology Co., Ltd

Datest Adds Akila XR-3 X-ray Inspection Capability to List of Offerings

Industry News | 2011-08-01 15:40:04.0

Datest recently added an Akila XR-3 X-ray inspection system from Christopher Associates to enhance its test service offerings. As Christopher Associates’ approved Demonstration Site for the XR-3, Datest will make its facility available for product demos and plant tours involving the XR-3.

Datest

The refinement of PCBA electronic components boosts the development of X-ray testing technologies

Industry News | 2022-08-23 03:26:21.0

Today's smart wearable and automotive electronic products are increasingly developing towards small, light, thin, short, and multi-functional Friendly mobile phone assembly and manufacturing new materials, what challenges will PCBA circuit board assembly technology and circuit board testing and testing technology face, and which aspects will it develop towards, ICT testing, flying probe tester, AOI testing, X-Ray inspection, 3D-CT inspection, etc., has become one of the important hot topics discussed in the electronics manufacturing industry.

Unicomp Technology Co., Ltd

Knowledge about PCB Panelization

Industry News | 2019-11-05 22:24:42.0

Designing a PCB for automatic assembly and full production runs requires a few design changes from an initial prototype PCB run. Today most PCBs are assembled and tested with automated machines from the data from PCB drawing files. With up to 80% of a new product's cost determined by the first prototype build, avoiding late changes and designing with manufacturing in mind can have a significant impact on the product cost, reliability, and yield of a PCB design. Luckily, if some good choices are made early in the design process, designing a PCB for manufacturing is relatively straight forward with few pitfalls.

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