Electronics Forum | Thu Apr 06 08:31:13 EDT 2000 | D Scott
Angela Do you see this problem on other .5mm pitch devices or is it only on the QFP? Check placement height, too low or to high can cause you problems Pad co-planarity, are your boards HASL? Is your board sagging during placement(board supports) An
Electronics Forum | Fri Feb 22 15:16:24 EST 2002 | rkevin
Bet your using tin/ lead plated components with a lead free Cu/Ag/Sn alloy. It leads to intermetallic cracking. Wow didn't anyone tell you to check the archives yet, It seems to be the answer given to everyone. Why have an interactive site if you alw
Electronics Forum | Wed Apr 14 14:51:10 EDT 2010 | jgalarza
After checking some of our stencil data for the correct aspect ratio I found that a few are wrong. I would like to change them from 5mil thk to 4mil thk but do not know how much paste volume I need to keep. We are using 0201,0402, and BGA with 0.80 p
Electronics Forum | Tue Nov 17 03:04:38 EST 1998 | Charles Stringer
For some as yet unkown reason, we have started to have some boards sag and go under the wave. The boards are surface mount top side and conventional components wave soldered. We have checked the wave hight and both the profiles on the wave solder and
Electronics Forum | Thu Apr 06 00:27:42 EDT 2000 | Dean
I would check their data sheet for the particular product. Thats the range I have for Some Kester products I use... Are you seeing any slumping prior to pick-and-place? Is the bridge in the same place every time? How is your pick-and-place mounting
Electronics Forum | Tue Apr 13 14:14:59 EDT 2004 | russ
I have actually printed this same condition with type 3 paste Alpha WS709. I posted this for discussion and cannot remember what I called it. We did need to clean the stencil after every three prints. I did not check volume on these locations but
Electronics Forum | Fri Apr 29 07:14:13 EDT 2005 | jdumont
Recently we have been seeing issues with an inability to print through .45mil apertures on our stencils. We have also been seeing a alot of solder balls under some BGAs (some worse than others). I was checking the refridgerator (small mini fridge) we
Electronics Forum | Tue Dec 26 21:28:56 EST 2006 | generalrp
Hello! About Dross reducing(recycle)everyone can check the following patent. US PATENT # 616,161 1898 year!!!! Also, from the contemprorary patents, US PATENT # 6,942,791 and some others. If using MS2 molten solder surfactant, every week you wi
Electronics Forum | Fri Nov 23 18:16:08 EST 2007 | g2garyg2
I may be able to help but would need to understasnd more about your application. The rating on the diode laser can directly effect its ability to refelct or penetrate the solder, but I would lnot to rule out beam placement at the joint either. If yo
Electronics Forum | Wed Nov 01 12:04:46 EST 2000 | JohnW
Adam, Didn't we do this already?, check the archives, I've discussed rotational carriers before. You can use them fo setting up an designing the pallet but you can't use them for mass prouction, for one your waisting valuable pallet space, for anoth
