Electronics Forum | Tue Feb 21 11:59:56 EST 2006 | dannyleach
We design a broad range of DC/DC power supplies for various telecom, internet, and computor applications and have been succesfully using intrusive reflow for ~7 years now. Our pcbs range from 0.065 to 0.090 in thickness and are moslty dense 4 to 8 la
Electronics Forum | Thu Jul 03 19:27:54 EDT 2008 | proy
5 Zone HVA70 Oven Board 6 layer, 10" x 13" lots of space, most critical is 100 pin QFP AIM Water Soluble 487 Tin Lead paste on SN100C HASL boards This board is giving me disproportionate grief! I am running 23 in / min which gives me about 3.1 mi
Electronics Forum | Wed Aug 13 05:18:40 EDT 2008 | lococost
that's a pretty cool idea, I like some thinking 'outside the box '! 1. I don't think picking it up and placing it will be much of a problem. once the rivet is placed it will be held in place by the paste. However, you would need to make a tray that
Electronics Forum | Tue Aug 18 22:22:43 EDT 2009 | comatose
Assuming you want to run 8 hours a day and 5 days a week, you need a sustained throughput of 2.5k components per hour. With fine pitch, futzing around, setup, etc you should really look for machines rated in the 4k to 5k per hour range. That's not sc
Electronics Forum | Wed Mar 15 08:18:29 EDT 2017 | rob
It's well documented in higher power semiconductors where thermal interface materials are used, such as SIL pads, thermal grease etc. There are a couple of papers on the effects of voiding on MOSFET performance, but I haven't got around to reading
Electronics Forum | Tue Aug 01 09:42:07 EDT 2000 | Gary
The Technical Services Group at Alpha Metals has spent a fair amount of time looking at wave soldered Pb-free connections. We too have observed fillet tearing, fillet lifting, and pad lifting. I have concluded that without major changes in the mate
Electronics Forum | Sun Feb 13 19:04:13 EST 2000 | Jackie Hsieh
First I'm a Taiwanese people so excuse my bad english writing. On my experience, The process of double side SMT procedure with two methods ---First one is appling the glue on the solder side, and placeing the R,C,L chips components on it.and 2nd one
Electronics Forum | Thu Sep 21 05:46:34 EDT 2000 | Wolfgang Busko
Once you know what your print should look like, means you have found the right apertures, stencil thickness, stencil finish and the right printer adjustments and alignments, the main things to watch for or better to control when printing is in progre
Electronics Forum | Mon Aug 28 14:12:51 EDT 2000 | Earl Moon
1/4 thimble! Obviously, you read none of may articles. HASL has more than a simple topographical problem, and so on. You also would know that TCE, while being an important issue, can be overcome as a problem with optimized pad designs. You would kno
Electronics Forum | Tue Jul 04 16:13:09 EDT 2000 | TOOLMANTIM
HELLO BILL I HAVE SOME QUESTIONS FOR YOU 1:HOW ARE YOU CLEANING YOUR STENCIL 2:ARE YOU SINGLE OR DOUBLE PRINTING. 3:ARE YOU USEING VACUUM FIXTURES OR NOT? HERE ARE SOME OTHER THINGS TO TRY. IF YOU ARE CLEANING YOUR STENCIL OFTEN BECAREFUL OF USEING
