Electronics Forum | Thu Jun 29 11:08:55 EDT 2000 | Dave F
Kok Han: Good to hear from you. Please help us understand you situation better by talking more about: � Component IC of the RF unit (IC101). For instance: SMT / PTH, package, pitch, lead material, lead finish, package type, package weight, coplan
Electronics Forum | Mon Mar 27 20:48:25 EST 2000 | Dave F
Robert: Howya doin' bud? You say "BGA Shorting!!!" I say "Too Much Solder!!!" So, earlier comments about aperture design are appropriate, make good points, and I think we both agree that improvements could be made in your stencil design, but I'm
Electronics Forum | Tue Apr 17 13:33:00 EDT 2001 | Kris W
Howdy all! Nothin' up my sleeve!!! While attempting to reflow an RF antennae on std FR4, HASL coated, using no clean paste, in a Research Thermaflo 10, the part sometimes slides on one of the pads (as much as 0.125"). There is a slight amount of w
Electronics Forum | Wed Jun 13 13:50:49 EDT 2001 | DaveG
I don't have any actual "hard" data to give on improvements but, I can share some experiences with you. What we noticed when we implemented the Rheo pump was: No more solder "skips" on our boards, Improved print quality on our BGA's & 16mil fine pitc
Electronics Forum | Tue Feb 01 21:48:12 EST 2000 | Dave F
Guo: You want to know: 1 Can I use water as the solvent in an ultrasonic machine to remove solder paste from PCB? Continuing from Jason�s comments: Sure you can use water as the solvent to remove solder paste from PCB, but recognize that some flu
Electronics Forum | Sun Nov 07 10:54:21 EST 1999 | Steve Thomas
We're looking at redesigning our stencils to facilitate better (well, it's pretty much non-existant, so any improvement is a big leap) release from fine pitch apertures. Currently we have perpendicular walled laser cut apertures. We'll be having
Electronics Forum | Tue Oct 12 16:08:44 EDT 1999 | Brian
| I need your help! We have been doing double sided surface mount for 4 years now. Up until 6 months ago I have not had a tombstoning problem. Since then I have a fairly high incidence rate of tombstones on the 0603 size resistors (no other parts).
Electronics Forum | Tue Oct 05 02:31:06 EDT 1999 | Eric
| | Hi everyone, I need some help on the whole process of double sided surface mount. We have been doing surface mount for about 3 months and we're getting ready to take on our first doule sided board. I just need some step by step process regarding
Electronics Forum | Thu Sep 30 13:37:08 EDT 1999 | Dave F
| | I am having problems processing immersion gold boards. The achieved solder joints appear acceptable a la IPC-A-610, but the resultant joint does not fully cover the land, i.e. you can still see an outline of gold pad. | | What is the best way to
Electronics Forum | Wed Sep 15 12:07:50 EDT 1999 | Earl Moon
| | Hi, | | | | Can someone pls suggest to me the best reflow temperature setting | | for a force air convection oven. The details is as follow. | | 1) Heller 1700s | | 2) 12 zone---6 top and 6 bot | | 3) Solder paste --- Qualitek 691 non clean | |
