Electronics Forum | Tue Sep 18 11:34:36 EDT 2001 | jschake
The tightest spacing between neighboring 0201 components assembled was 8-mils. Please refer to the response for the query entitled �Minimizing Tombstoning Defects� posted by martys, as the response provided there is also relevant to address this que
Electronics Forum | Tue Sep 18 16:48:55 EDT 2001 | jschake
Why do you think that assembling the BGA, QFP, and fine pitch parts will solve your bridging problem? I would think doing this may cause you more grief by having these more massive components being reflowed upside down fall off during the second pas
Electronics Forum | Tue Sep 25 12:50:13 EDT 2001 | mparker
Since you are mostly concerned about the flux and suspect an application issue, you need to do a few things to validate whats going on. 1. Forget about speed of processing, length of time to do the job. Focus on accuracy first, then speed. with that
Electronics Forum | Wed Oct 03 17:07:52 EDT 2001 | davef
We have had soldering problems with fine pitch QFP in the past [and probably will in the future]. Several questions leap to mind: * When you took your profile on the component pads, do you profile on the pads that did not solder well? * When you say
Electronics Forum | Tue Oct 09 12:23:07 EDT 2001 | Mike Konrad
Hi Danial, Yes, you can use one cleaning chemistry for all paste types. There are many available chemistries from many manufacturers. The chemistries that I would recommend include: StencilWash Plus from Aqueous Technologies http://www.aqueouste
Electronics Forum | Wed Jan 16 15:22:29 EST 2002 | Terry Burnette
In his book titled "Manufacturing Techniques for Surface Mount Assemblies" author R.J. Klein Wassink describes the relationship between solder land dimensions, component lead coplanarity, board warpage, solder volumes, and solder paste flux wetting b
Electronics Forum | Wed Mar 27 07:41:54 EST 2002 | paul_stamper
As Mitchell stated before, the cleaning of the stencil is rather important. When considering stenciling of adhesive you must review your stencil cleaning process. The recomended process is a ultrasonic cleaner with a heater option. These systems are
Electronics Forum | Thu Aug 08 10:58:18 EDT 2002 | Tom Gervascio
I'm interested in sharing any information on bumping of LAnd Grid Array (i.e. QFN) packages. due to PCB contraints, it's not possible to stencil paste onto sites for QFNs. That lead to a lot of experimentation with bumping of 6 mm QFN packages.In sum
Electronics Forum | Fri May 24 11:46:34 EDT 2002 | tmv
Lot's of good discussion in this string...but I think we've missed a few points. First off...turret machines are more than capable of handling the smaller component sizes (in fact, they are the best)...Machines like the SANYO TCM-3000 or Universal 47
Electronics Forum | Wed May 22 21:01:49 EDT 2002 | davef
Ah, the customer is always correct, again. And you are officially �painted into a corner�. Actually, your customer is not correct. Thinking that money is going to be saved by specifying copper component terminations [or whatever in the world they
