Electronics Forum | Thu Oct 26 08:59:57 EDT 2000 | ptvianc
Performing a wetting balance test would be very difficult. The flux cored wire "configuration" is just not compatible with the methodology of the wetting balance test. If the wetting balance is a must, then you might ask the vendor for the flux for
Electronics Forum | Thu Oct 26 09:10:30 EDT 2000 | ptvianc
I am not familiar with the "HALT" terminology. Do you mean HAST testing? As for thermal fatigue, the most severe conditions are typically those cited for military and/or satellite applications. There are several temperature ranges that are used to
Electronics Forum | Wed Sep 20 09:37:15 EDT 2000 | Erick Russell
Determining cost of rework is based on usage and application. Photonic soldering saves an average of 5 minutes per rework site in process time and may save a significant amount of labor. Depending on volume, and specifics on the application, the cos
Electronics Forum | Wed Sep 20 10:42:05 EDT 2000 | Erick Russell
Process control for Photonic soldering is based on the actual temperature of the component being reworked. If the desired temperature of the component for your process is 200C then that is the process temperature programmed. This is achieved by a cl
Electronics Forum | Thu Aug 24 09:41:46 EDT 2000 | Dr. Ning-Cheng Lee
The optimal profile to choose is determined by the following factors, (1) thermal mass and distribution across the board, (2) reflow temperature range needed for a particular alloy, (3) the nature of flux. When the thermal mass is small, such as cell
Electronics Forum | Wed Aug 23 14:49:27 EDT 2000 | Dr. Ning-Cheng Lee
Yes, you are right. It is so small a quantity, the actual threat on human health is really questionable. I believe this is the reason why the Pb-free issue faded away gradually several years ago in USA. Too many people didn't believe it is important
Electronics Forum | Tue Aug 22 10:47:28 EDT 2000 | Dr. Ning-Cheng Lee
The European WEEE has issued a new (5th) version of its recommendations. In it they say that , on January 1st, 2004, they will review the status of the Pb-Free issue. There is currently NO DEADLINE for implementation. As far as a direct replacemen
Electronics Forum | Tue Aug 22 10:53:45 EDT 2000 | Dr. Ning-Cheng Lee
Excellent question. Alloy development is relatively easy compared to flux formulation. New fluxes for Pb-Free alloys need upgrades in 2 critical areas: 1) thermal stability 2) oxygen barrier efficiency Since the Pb-Free alloys require reflow proce
Electronics Forum | Thu Jul 20 16:15:24 EDT 2000 | Bob Willis
Sorry at the moment I do not have information but as usual I want to get some hands on sessions going. We were doing a flip chip workshop hands on session for Speedline last week in England. We did the theory and then hands on soldering and underfill
Electronics Forum | Thu Jul 20 13:58:47 EDT 2000 | Bob Willis
Well you can do both but why clinch the leads ? You are not referring to the SPOT process my friends at Camelot talked about some years back are you ? You can dispense paste but it�s a lot slower than printing. You can select a pin and dispense dire
