Electronics Forum | Sun May 02 06:15:58 EDT 2010 | stephan
I look for specification for degolding - pretinning for SMT and through hole parts (in the military sector) . I found IPC JSTD 001 and some ECSS ...08 but without visual real criterias on the product. Thanks for your inputs .
Electronics Forum | Wed May 05 08:50:37 EDT 2010 | flipit
You will want to look at the Mil Specs. I believe they are all available online in pdf format at no cost. I am not certain what the latest spec is but Mil-Std-2000 absolutely has a section on this.
Electronics Forum | Mon May 03 08:42:12 EDT 2010 | dekhead
The $20K number thrown out there by the OEM would lead me to believe there is something else going on and/or it's the black camera vision... green/silver they usually use the $10K. DEKHEAD
Electronics Forum | Tue May 11 13:39:08 EDT 2010 | smt_guy
yes sir you are right. at least 10 mil diameter endoscope. thanks and regards
Electronics Forum | Tue May 11 08:35:26 EDT 2010 | cyber_wolf
If you see flux separation mix the paste with a spatula before you transfer it. There is no need for a centrifugal mixer.
Electronics Forum | Thu Jul 08 02:32:47 EDT 2010 | tivux
I soldered a wire in the tape press lever of th feeder, so as to create a small gap where the cover tape passes and the component doesn't: in this way the component is pushed down in the pocket as soon as it tries to follow the cover tape. regards,
Electronics Forum | Thu Jul 08 09:38:26 EDT 2010 | fredc
Could this wire be helping by a second means, becuase it is grounded to the feeder it may be discharging the static at the point it is being produced? If so it could be bent to contact the film and not scratch the LED lenses.
Electronics Forum | Fri Jun 04 08:33:44 EDT 2010 | karthikthebest
Hi, Just have a look at the tech sheet on VIP, looks likes a continuing story until IPC defines the criteria in a better way
Electronics Forum | Thu May 20 08:51:29 EDT 2010 | jry74
A lot of our dewetting is happening on plastic body components, such as ICs. When they are manufactured, the molding process requires a mold release to make the part release after molding. Usually, the release agent is silicon based, but you can't
Electronics Forum | Tue Jun 08 16:13:22 EDT 2010 | rwyman
Why reinvent the wheel, Bart? You can buy a thermal barrier from one of the logger manufacturers (M.O.L.E., KIC, DataPAQ, etc). They come in varying sizes and temperature ratings. Maybe you can find one that suits your unit. Good luck.
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