Electronics Forum | Thu Feb 04 18:45:56 EST 1999 | Earl Moon
| Actually, solder paste adds about 12% to the joint volume for PBGAs, or about 31% for MicroBGAs -- assuming standard (recommended) pad sizes and stencil thicknesses, and paste with 90% metal content (50% metal by volume). Michael, In the "real wo
Electronics Forum | Fri Feb 05 08:34:51 EST 1999 | Nancy Vandemark
Love the picture. We are considering the PRC 1500. It combines a thermoflo unit with a MBT 250A which we currently use. Does anyone know the difference between the TF200 and the TF700? This is the first I have seen the TF700 mentioned. Also, what
Electronics Forum | Fri Aug 06 10:27:05 EDT 1999 | Kenneth Hedman
| | I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? | | | | Thank you, |
Electronics Forum | Wed Jan 20 21:25:32 EST 1999 | Tony A
| I get white residue on my PCBs after vapor degreasing. No comments on the vapor degreaser. Yes, I still use one of these. I use a vapor degreaser and a 1,1,1 replacement solvent due to the quick clean and quick dry times. Anyway, I only get whi
Electronics Forum | Wed Dec 30 16:04:15 EST 1998 | former co-worker of yours
| I need advice on a pad design which several other engineers whom I work with would like to try. I think it is an utterly crazy but I can't seem to convince them differently. | | My current 0402 chip pad sizes on alumina and FR4 substrates are .
Electronics Forum | Tue Dec 15 15:45:50 EST 1998 | Chrys
| Okay here is the deal. I am fairly new to the company here, but one thing I have noticed is that we read way to many fiducials, in my opinon anyway. One for example is this. One assembly was reading 17 fids. Smallest pitch was .25mil I say you
Electronics Forum | Tue Dec 01 07:24:44 EST 1998 | Earl Moon
| Hi folks , | Lately we are seeing a lot of rawcards with black spots on the pads - most of them have Au finish(immersion gold) . We did a lot of inspecton after wave solder and found that only (fine pitch) QFP are affected the most. Our inspection
Electronics Forum | Tue Dec 01 07:54:49 EST 1998 | kallol chakraborty
| | Hi folks , | | Lately we are seeing a lot of rawcards with black spots on the pads - most of them have Au finish(immersion gold) . We did a lot of inspecton after wave solder and found that only (fine pitch) QFP are affected the most. Our inspec
Electronics Forum | Tue Dec 01 10:52:36 EST 1998 | Dave F
| | | | All y'll: I could use your input on determining when to skim dross from a wave solder pot. | | | | | | | | On one hand, dross protects the surface of the solder from oxidation. On the other hand too much dross may affect solder joint quali
Electronics Forum | Wed Dec 09 00:24:25 EST 1998 | Erwin Dorol
| | | | |1. What is your minimum dross generated that triggers you to procure an SRS? 2. For a 8 to 10 Kg of dross generated daily, what capacity of SRS capable of recycling these amount of dross without compromising other cost factors? Or I
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