Electronics Forum: electron (Page 6453 of 7890)

Re: Open v.s viscosity

Electronics Forum | Thu Apr 20 21:45:10 EDT 2000 | Dave F

Wister: Oooo, I understand now what you mean by "an open." Sorry, I was (am) a bit dense. Your hypothesis is reasonable. On the other hand, have you looked at the traditional causes of tomb stoning also? For a defect to be a "tomb stone," it doe

Convection Oven and thermo profiling of Circuit Boards

Electronics Forum | Mon Apr 17 19:42:34 EDT 2000 | Russ Cutler

We just bought a new Heller 1800 EXL reflow oven for reflowing SMT boards. We us a low temp RMA solder paste with 2% silver. Everything we build is to IPC Class 3 specifications. We have approximately 600 different types of circuit boards we build

Re: Convection Oven and thermo profiling of Circuit Boards

Electronics Forum | Tue Apr 18 19:37:35 EDT 2000 | Russ Cutler

Let me be more specific about my dilema. We have used a vapor phase reflow process for many years. We just bought a Heller 1800 this year (2000). We may very well be able to run all 600 very different board types we build in 10 recipies on the Hel

Re: Convection Oven and thermo profiling of Circuit Boards

Electronics Forum | Wed Apr 19 14:07:20 EDT 2000 | Russ Cutler

Let me see if I've got this straight...rather than hook up a MOLE or a KIC profiler to each and every board (600 P/N's in my case), most people are making judgement calls based solely on how similar a board looks to another board, for which they have

Re: CSP Rework

Electronics Forum | Thu Apr 20 09:49:01 EDT 2000 | Dave

Why worry about the temperature if the top of the chip is 20 degrees C above eutectic - 183 C(at the balls)...if a machine works at convection oven temperatures, with high power, then there's no need to worry...Also, a CSP is a very forgiving chip.

Converting to 'No-Clean' process

Electronics Forum | Fri Apr 14 13:30:20 EDT 2000 | Murad Kurwa

Hi All: Can you tell me specifically if you converted an exiting product made with Clean process using WS609 or compatible to 'No-Clean' process. We have to convert assemblies from current clean process at a CEM to No-Clean process in our own factor

uBGA rework and X-Ray inspection

Electronics Forum | Thu Apr 13 18:28:01 EDT 2000 | Michael Parker

Hello - I am currently evaluating uBGA rework and X-Ray inspection solutions. I would like any advice/warnings etc. regarding suppliers and equipment. I have already researched through the threads in this forum and have created a list of recommended

PCB finishing

Electronics Forum | Thu Apr 13 03:46:19 EDT 2000 | PeterB

We are a small/medium contract manufacturer and like most we do our best to ensure that PCB's we process are panelised to ensure efficient throughput and good quality results. Sometimes however we are stuck with free issue PCB panels supplied by som

Re: PCB finishing

Electronics Forum | Thu Apr 20 05:35:25 EDT 2000 | Keith Stone

Hi Pete We have a Black and Decker Power File and have mounted it on a bench in an enclosure to capture the hazardous dust. We used a hopper (usually used for guttering!) with a wire mesh over the top (static reasons) mounted in the bench top inside

Re: Help Bottom Side Components

Electronics Forum | Wed Apr 12 20:56:18 EDT 2000 | Dave F

Kevin: You're correct. Loose the glue, unless you're waving second side or have real heavy components. Check the archives for component weights, references, and what not. I believe that most people (let's see a show of hands kids) are using two pa


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