Electronics Forum | Wed Mar 08 19:29:55 EST 2000 | Charles Leech
This is just an Alert: We had a lesson on the effect of air shipments of devices which have been fully saturated with moisture. After being in a pressure cooker for two hours in Singapore, devices were sealed in metalized vapor barrier bags. They we
Electronics Forum | Mon Mar 13 14:41:22 EST 2000 | Boca
By Hot Air Knife I assume (leave it alone Dave F.) that you mean a debridging knife located at the exit end of a wave solder machine. Russ is right, they are not a good substitute for a good process, but once the process (w/o HAK) is developed, it
Electronics Forum | Mon Mar 13 14:45:01 EST 2000 | Boca
By Hot Air Knife I assume (leave it alone Dave F.) that you mean a debridging knife located at the exit end of a wave solder machine. Russ is right, they are not a good substitute for a good process, but once the process (w/o HAK) is developed, it
Electronics Forum | Thu Mar 09 20:48:30 EST 2000 | Dave F
Van Hoang: Welcome to SMTnet!!!! Regarding your problems: 1. Cleaning glue: Check the SMTnet archives. For instance, a recent thread was: cleaning glue off of stencils - pr 13:41:43 03/03/2000 2. Bridging on the wave: Bridging on the wave h
Electronics Forum | Fri Mar 03 10:07:15 EST 2000 | Wolfgang Busko
Hi Jacqueline, - what a name in this technical world - I just tried the calculator and for example choose the CQFP and then selected other and an input mask appeared where you have to fill in the required data from the components datasheet. I have to
Electronics Forum | Wed Mar 08 10:52:27 EST 2000 | Wolfgang Busko
Hi Jacqueline, for the "manufacturing allowance" IPC says FAB.TOL. is the board manufacturing tolerance and PLACE ACRCY is the pick and place accuracy. For 0,8 mm pitch they give for both values 0,1 mm. Solder joint design goal data comes from empir
Electronics Forum | Wed Mar 01 17:13:15 EST 2000 | Dave F
Sorin: Formulas for calculating heat dissipation of traces don�t seem to provide practical results. But there are some wonderful tables and graphs that will meet you needs. You may need to do some finagling when calculating vias and through holes,
Electronics Forum | Tue Feb 29 13:18:16 EST 2000 | Steve Schrader
We have what appears to be a recurring problem. On immersion gold boards only, we are having solderability problems. After reflow, selected parts can be popped right off the board. There is then a dark haze left on the pad. The paste on the compon
Electronics Forum | Wed Mar 01 17:03:56 EST 2000 | Dave F
Steve: Someone is trying to trick you. He/she is trying to be very smart, but he/she didn�t anticipate this "dark haze" coating problem. I suspect that this person is someone you speak with every day in your plant. They may be the one that came-u
Electronics Forum | Thu Mar 02 21:24:27 EST 2000 | Dave F
Glen: As I mention in an earlier response in this thread, I think someone at Steve's plant (or may be in his packaging spec for the fabs) is doing something to leave a residue, but I'm also thinking solder mask ... ENIG can be applied before or aft
