Electronics Forum | Thu Oct 07 07:58:29 EDT 2010 | scottp
The problem is there are also studies showing reduced reliability. Early thoughts were that if you got complete reflow of both solder materials then you'd be fine, but several studies have shown that there's something going on that's not well unders
Electronics Forum | Tue Feb 01 10:11:36 EST 2011 | clampron
good Morning, it looks from the peak temperature that this is a RoHS application? If so, is the BGA that you are having issues with leaded? If so, you might be experiencing "ball drop" where the ball becomes disconnected from the component substrate
Electronics Forum | Wed Apr 06 08:18:19 EDT 2011 | don7888
Hi Has anyone managed to accurately produce a spreadsheet or formula that will accurately calculate the amount of boards your SMT line will produce an hour. I work in a high mix low volume industry and we are constantly taking on new jobs but have n
Electronics Forum | Thu Apr 07 04:32:13 EDT 2011 | jacki
Dear All During SMT process, some Tant caps were fell down without touching Epoxy . I found the problematic Tant Termanations were bended with gap. So I called to Vender and expalined this gap but the answer was the gap was within their standard and
Electronics Forum | Thu Sep 22 14:25:13 EDT 2011 | hegemon
Dave has stated the caveats well. I too have similar experience in reworking BGAs that mirrors your own. The only situation where I saw this as an issue, was in memory devices where a row of BGAs might share a commonm heatsink. In those cases the
Electronics Forum | Fri Dec 09 11:00:27 EST 2011 | alexanderb
Dear All, I am a totally new to the SMT process. In fact, I just had an overview course regarding the whole process of PCBA manufacturing and I have know a bunch of questions in my head. Most of them are linked to the solder paste printing process
Electronics Forum | Mon Jul 02 18:40:33 EDT 2012 | joeherz
We used to have a Nuclean 324 that was running closed loop with a DI water recirc system. We also had problems with foaming that was solved with a relatively simple fix. We bypassed the final rinse solenoid so that it was always running. This allo
Electronics Forum | Wed Aug 15 19:55:46 EDT 2012 | hegemon
If you are doing X-Ray post place and pre-reflow you should be good. Look elsewhere. Check profile - full lead free or hybrid? Be sure you are acheiving the required reflow temps and TAL required for the solder paste too. Check for belt movement
Electronics Forum | Thu Oct 25 13:33:18 EDT 2012 | cyber_wolf
Ken, The photo looks like results I have seen because the gold flash was too thick on the board. This causes a condition known as gold imbrittlement. You may want to get an analysis of the plating thickness. I'm not real experienced with immersion si
Electronics Forum | Thu Oct 04 10:54:11 EDT 2012 | eniac
I have only one incredible idea: this is example of different speed of heat transfer of neighboring pads. I saw it two times during last years, but on lead solder pastes (Sn63Pb37). The reason of this mistakes each times we found two: 1. errors duri
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