Electronics Forum: after (Page 650 of 698)

Excess Flux in uBGA rework

Electronics Forum | Mon Sep 24 17:38:18 EDT 2001 | mparker

First question - do you have a rework station? If so, are you experiencing the same type of failures there? I have successfully used no-clean on uBGA's in the past. 6 mil solder bumps, 10 mil spacing. 88 sites. Are you reusing previously soldered uB

Placement Program Tweaking

Electronics Forum | Fri Oct 19 17:41:21 EDT 2001 | Stefan

I used to love tweaking. I tweaked and tweaked until I got a master degree in tweaking. But than I had to teach others how to program a board and avoid tweaking. After all it does not go quite conform with ISO and other quality approaches. I investig

Adhesive Dispense Equipment

Electronics Forum | Sat Oct 27 12:01:32 EDT 2001 | Stefan Witte

Most of the machine suppliers Fuji, Siemens, Universal and Panasonic did regret that they were building glue machines. Applying adhesive compared to placing a component looks so simple, but it is not and the defect rate is higher than placing 1206 c

Where's The Drill? ... or responsibility

Electronics Forum | Fri Nov 23 05:52:45 EST 2001 | Wolfgang Busko

What Claude is saying may be right. But looking at it a bit different from the view of "senior management" this should be interpreted as depending on the salary the work itself is different and therefore the responsibility is different. It doesn�t na

Your Input needed for new SM Resource

Electronics Forum | Fri Mar 01 09:10:50 EST 2002 | caldon

Andrew- I look for usefulness in web sites.I hate having news mail sent to my email box. Having a site post technical information, links to useful stuff, and all around beneficial information is good. It seems to me the vogue thing on the Technology

Moisture Barrier bags

Electronics Forum | Fri May 03 10:51:24 EDT 2002 | fmonette

Dave is correct. I am including additional information that comes from a recent posting on another industry forum : The proper guidelines for bag sealing are actually specified in the JEDEC standard EIA/JEP124 section 5.2.1 Packing moisture-sensiti

Moisture absorbtion in circuit boards

Electronics Forum | Tue May 21 20:27:05 EDT 2002 | davef

No N2. We could not fix a benefit for N2 in our minds. Just fold the excess bag material over to expell most air and then seal the bag. [Have you assessed the benefit of N2?] F Monette can tell you stories about little versus more pressure. If he

imm. silver

Electronics Forum | Fri Aug 30 16:25:21 EDT 2002 | davef

Imm silver holds-up to multiple thermal cycles very well. The things, we guess, are happening to make imm silver tough to solder after heating and sitting are: * Oxidation of the silver. * Reduction of the co-deposited organic anti-tarnish [used in

Power problem on radio circuit

Electronics Forum | Fri Sep 13 10:59:35 EDT 2002 | Simon Davis

Hi Folks, This is a totally speculative, if not cheeky post. I know very little about electronics, but I think you guys do. I have a problem with my car radio, that I'd really like to solve, as I cannot buy a new one where I live (Brazil), and I th

best buy? (printers)

Electronics Forum | Mon Nov 04 17:29:34 EST 2002 | pjc

Cannot comment on "best buy". You'll have to determine what the better machine is for your application and duration of planned use. I suggest taking a field trip to each vendor's nearest demo facility with a few of your most hi-tech boards and stenci


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