Electronics Forum | Thu Aug 24 13:20:24 EDT 2000 | Murad Kurwa
One of our divisions is having this problem: - De-wetting on the smt pads and componenent termination on the bottom side after top side procssed through reflow. Board finish is immersion silver. ? Any recommendation on what we should check & verify
Electronics Forum | Wed Aug 23 09:35:35 EDT 2000 | JAX
Andy, AOI is a worth-while tool for verifying part placement on those pesky little telecommunication boards that are too small for referance designators. It can also be a valuable verification step to reinforce quality control. Pros and Cons o
Electronics Forum | Wed Aug 23 14:52:10 EDT 2000 | Steve Thomas
Every forum I've ever frequented has been plagued with repeat questions. It's not just technical forums, either. Until someone creates a forum that funnels first time users DIRECTLY into the FAQ (and not just the ones about how the forum works)an
Electronics Forum | Tue Aug 22 05:10:56 EDT 2000 | Wolfgang Busko
Ron:It�s tricky to get what you want with this foamfluxers espacially using pallets. They got to be cleaned regularly. Most of the time excessive residues are removed using brushes which adds another process step. It should be better using a sprayflu
Electronics Forum | Thu Aug 17 05:56:39 EDT 2000 | Jacqueline
Hi Folks, Hope yous can help. I'm having a problem when reworking (placing) 40mil BGAs. One side seems to be collapsing more so that the other, resulting in the outer row of balls not properly reflowing and making the connection. This is only happeni
Electronics Forum | Thu Aug 10 13:36:48 EDT 2000 | Bob Willis
I recently have been examining multilayer board failures. They are the classic inner connection failure between the foil and the through hole plating which I have not seen in many years. Has any one experienced any issues recently specifically relati
Electronics Forum | Fri Aug 04 10:08:18 EDT 2000 | John Thorup
Zactly...what type and size of component. Pressure sensitive or heat seal cover tape? Manufacturer or service house taped? One or all manufacturers/distributors. Are the components in the right size tape? Reasonably recent production? Are they rea
Electronics Forum | Wed Jul 26 18:23:47 EDT 2000 | Gary
I have been following forum discussions here and eslewhere, attended technical sessions at APEX and have been experimenting with the paste-in-hole process on some of our new product. I have run into one problem I have never seen mentioned, that is a
Electronics Forum | Mon Jul 17 20:30:39 EDT 2000 | Dave F
We are trying to improve the decision process for our Material Review Board (MRB. We have a fairly standard defect identification and MRB process. We are pretty comfortable with our ability to: � Identify problems components and assemblies. � Segre
Electronics Forum | Wed Jun 04 07:36:10 EDT 2003 | kadaba
DEAR FRIENDS. I APPRECIATE THE SANJEEVS COMMENT . LOOKS LIKE EVERYONE WENT IN SEARCH OF MVT RATHER FOCUSSING ON ABOUT THE AOI. ANY WAY.... I to some extent agree with Alex on the asia scene where the subcontractiung process is very cost competative
