Electronics Forum | Sat Jul 31 13:35:14 EDT 1999 | Miguel Mariscal
| Has anyone done the research on BGA pad size? suppose I have a 0.030" diameter pad as recommended pad size from the spec, what will the minimum pad size allowed? We are laying out a high density board. | If you know what component your'e going to u
Electronics Forum | Tue Aug 23 03:29:37 EDT 2022 | samhe
I received a buck-boost DCDC board with an optical sensor from NextPCB, so I mounted the components and measured the efficiency. Table of contents Board received from NextPCB Solder paste printing Mounting of parts Reflow operation check Attaching
Electronics Forum | Fri Sep 07 16:37:47 EDT 2012 | burb1999
Ive used the Camalot long time ago to dispense paste on BGA pads after removal then reflow with a machine such as the AirVac. What is the best way to do BGA repair on pads? Ive read alot just reball the bga then put it back on? Todd
Electronics Forum | Thu Dec 21 13:35:32 EST 2006 | ppcbs
Send it to the BGA Rework Specialists at: http://www.pcb-repair.com
Electronics Forum | Fri Jun 05 17:36:39 EDT 2009 | gsala
what do you think about Moisture entrapped into BGA or PCB before reflow ? regards GSx
Electronics Forum | Sun Feb 19 12:07:21 EST 2017 | ctran
Did you use Removal Profile for Rework or Reflow Profile to remove the BGA?
Electronics Forum | Fri Oct 15 10:35:44 EDT 2004 | russ
sounds like you have a very thin layer of mask on some pads to me. Russ
Electronics Forum | Wed Jul 01 12:26:52 EDT 2009 | ewchong
can anyone suggest possible causes or further analysis for the lifted pads in attached picture. thanks.
Electronics Forum | Wed Jul 08 16:28:25 EDT 2020 | duchoang
OSP board finish is the issue. With OSP microBGA board, we need to have enough paste (enough flux) on pads (small pads on BGA), also we need to have strong, more activate flux to get rid of Preservative layer on top of pads. In this case, the OSP did
Electronics Forum | Thu Aug 01 04:12:39 EDT 2002 | jk
Anyone have experience with BGA mount on via hole in pad. I'm encountering about 1 to 2% yield loss due to BGA solder short. This is an entek PCB. The BGA pad size is 32 mil, and the via hole (dia. 10 mil) is at the center of the pad. Any professiona
