Electronics Forum: flats (Page 66 of 80)

Quoting Software suggestions please!!!

Electronics Forum | Mon May 07 12:18:06 EDT 2007 | wavemasterlarry

Nuts to that! Here's the right way todo this. I generally take a bill of Material and go line by line and charge accordingly. If there is a smt cap I charge 2.3 times the amount I pay, unless it�s a bigger than a 1206, then I charge 3.1 If it�s

Conformal Coat Thickness

Electronics Forum | Mon Jul 23 11:44:40 EDT 2007 | davef

NASA-STD-8739.1, 10.2.3 Thickness Measurements. Thickness measurements shall be made on coupons processed at the same time and under the same conditions as the PWA. The coupon substrate may be any compatible rigid material with a smooth flat surface.

BGA reflow on bottomside

Electronics Forum | Wed Nov 21 08:45:33 EST 2007 | davef

Rob: You say, "We usually determine our run process based on the heaviest components, and propensity for falling off during the second reflow process. If there's only the one BGA on that side of the board, we'd tend to run that side first." We agree

Epoxy application

Electronics Forum | Tue Nov 20 19:08:15 EST 2007 | Peter

Hello, I would like to ask for opinion on an epoxy application. We apply RTV to bond and secure 2 electronic devices on a PCB. But after noticing the RTV bond breaking off during vibration test, our customer has specs in a 5min 2-part epoxy (made

Solder Paste Inspection Systems

Electronics Forum | Fri Dec 28 17:44:41 EST 2007 | flipit

Back in the mid 90s I used an SVS 3D solder paste inspection system. We used it as a stand along unit but it was an inline model. We would bring printed PCBs off the Dek 265 solder printers and check every 5 or 10 printed panels. They almost alway

BGA Inspection Criteria (IPC-7095)

Electronics Forum | Wed Jan 23 01:24:45 EST 2008 | dragonslong

Hi ppl, i just joined my company as a quality engineer and was revising our incoming visual inspection. I was reading the IPC guidelines of IPC-7095. However, i have some problems which i hope the experts from this forum could help. IPC-7095: At on

BGA Baking in Reels?

Electronics Forum | Fri Feb 01 16:11:08 EST 2008 | operator

They have been having a lot of fallout and they believe it is one of the BGAs that is causing it. I tell all my customers that it is better to stay away from baking if possible and to practice proper storage techniques. But the thing is they insist o

Siemens S-27 Error Code Descriptions and Segment Issues

Electronics Forum | Tue Sep 02 15:35:55 EDT 2008 | modernprecison

I have a Siemens S-27 and I'm having occasional issues with 0201 components in particular. I'm using the 12 segment head and 902 nozzles with them. I'm making sure the magnet is clean of debris and the feeder is sitting flat. Most of the time they

Mydata M12 issue

Electronics Forum | Tue Oct 27 15:53:23 EDT 2009 | smtspecialist

Sr.Tech is absolutely right !!! This is where I had started, by changing all 4 brushes on the motor then I changed the connector since it was turning black (Mydata have a retrofit connector assy for that!, you can do your own also!) After trying thos

Temperature Profiling

Electronics Forum | Thu Dec 10 19:15:07 EST 2009 | swag

We like to keep one fully populated SMT golden per product (high volume) with t-couples soldered to it. We have best results using high temp. solder to attach t-couples (most permanent). 1) Remove all production solder from the part you are wanting


flats searches for Companies, Equipment, Machines, Suppliers & Information

2024 Eptac IPC Certification Training Schedule

Have you found a solution to REDUCE DISPENSE REWORK? Your answer is here.
2024 Eptac IPC Certification Training Schedule

Component Placement 101 Training Course
PCB Handling Machine with CE

World's Best Reflow Oven Customizable for Unique Applications