Electronics Forum | Thu Dec 24 08:44:25 EST 1998 | Earl Moon
| | | | Folk's, | | | | I'm in need of some help / direction. I'm working on my thesis for a masters based on looking at the effect's of the solder resist promoting / reducing the amount of solder ball's during wave. I'm looking at thing's like colou
Electronics Forum | Thu Feb 24 11:05:53 EST 2000 | Russ
I usuallly like to have the pad size the same size as the ball up to +2mil, the pcb solder mask opening to be +4 mil from the pad size (I have found this to aid in Xray inspection for opens since you can see the little tail of the solder wicking up t
Electronics Forum | Wed Apr 25 16:08:24 EDT 2001 | jmills
We build a product that requires a lithium battery. There is a Smt Battery clip soldered onto two gold pads on a FR4 PCB. The battery is forced by two little clips punched out to provided downward pressure in the battery holder, enabling the lithium
Electronics Forum | Wed Apr 25 16:09:45 EDT 2001 | jmills
We build a product that requires a lithium battery. There is a Smt Battery clip soldered onto two gold pads on a FR4 PCB. The battery is forced by two little clips punched out to provided downward pressure in the battery holder, enabling the lithium
Electronics Forum | Wed Apr 25 16:12:18 EDT 2001 | jmills
We build a product that requires a lithium battery. There is a Smt Battery clip soldered onto two gold pads on a FR4 PCB. The battery is forced by two little clips punched out to provided downward pressure in the battery holder, enabling the lithium
Electronics Forum | Tue Mar 27 09:06:10 EST 2001 | dblsixes
We have tried to adjust the upper and lower heaters. We have a dillema in this area however. The power supply portion of the assembly has thermal vias in the solder pads underneath larger pads. We have a problem with solder wicking through these h
Electronics Forum | Fri May 02 09:37:23 EDT 2003 | Jerry Magera
Via in pad is the most efficient use of space. Blind via seems to be blamed for this. Cross-sections (send me some) will probably show a void still existing in the via or spherical voids aligned near the component pad side. One can estimate the vo
Electronics Forum | Thu Oct 25 13:35:47 EDT 2012 | davef
Here's a paper that may help http://www.ipcoutlook.org/pdf/assembly_challenges_bottom_terminated_ipc.pdf Temperature Impact * Profile didn’t have a significant impact on voiding. * Voids slightly increased with higher temperature. Reflow Atmosp
Electronics Forum | Thu Nov 12 10:05:05 EST 1998 | Doug Clement
| | I have a need to dispense a latex masking material using an automated dispensing system. We are presently looking at the I&J750. Does anyone have any experience with this piece of equipment, or have a better solution available? | | | Doug: Fi
Electronics Forum | Thu Feb 19 19:34:52 EST 2004 | Tom B.
Jim, There are 2 thoughts to this technology. SMDP (Soldermask Defined Pads) Can achieve more uniform opening of the land, yet as you know Regisration shift of mask can become a problem. Also there has been debate as to whther SMDP cause crack p
