Electronics Forum | Fri Oct 05 08:35:52 EDT 2001 | Hussman
Hey Steven, Achieving the proper profile like you described does require you to engineer proper conveyor speeds and zone temps. Most conveyorized ovens have the inside of the ovens divided into zones. Each zone has a top and bottom heater that can
Electronics Forum | Wed Oct 10 13:49:12 EDT 2001 | stepheno
I recently started at a new company. They have a variety of bare PCB's and most have aprox. 20 variations. Maybe about 1/3 of each board on average are non-populated locations. They buy one stencil for each PCB but then use scotch tape to block of
Electronics Forum | Tue Oct 23 08:38:52 EDT 2001 | MikeF
Dave, Thanks for the suggestion on the used equipment brokers. I had done a search of the Marketplace for this machine, but should have thought to contact one of the brokers. Vitronics can sell me a manal, but has noted the manual does not have any
Electronics Forum | Tue Oct 30 22:08:45 EST 2001 | flynhi34
I have not looked into eutectic die attach. My dies are about .012" square and could get smaller. Currently using a Epoxytech conductive adhesive. I am going to go out and look at equipment and build samples. Some vendores state they can do .010"
Electronics Forum | Wed Nov 07 21:16:44 EST 2001 | davef
Consider using the following hierarchy of rules for pad design: 1. If you have a land pattern in a manufacturer�s data sheet, use it. 2. If the data sheet doesn't have a land pattern, but does have an RLP (registered land pattern) number or JEDEC n
Electronics Forum | Tue Nov 13 11:22:50 EST 2001 | fmonette
Dave, Hany, I was actually surprised to hear that topside SMT components can reach such a high temperature during wave soldering. If this is the case then the concern for component damage is very valid. This morning I discussed this issue with Jac
Electronics Forum | Sat Nov 24 22:15:16 EST 2001 | Glenn Robertson
Tony, I'm not sure if even baking will stop the voids if you have gaps in the plating. It probably doesn't take much moisture or even trapped air. I'm not speaking from a lot of direct experience here, so please run the tests and let us know wh
Electronics Forum | Tue Dec 04 13:23:05 EST 2001 | fmonette
Hi Steve, It sounds like your product will have many moisture-sensitive devices on both sides. You should be aware of the additional controls that are required to insure the reliability of these components in a double-side reflow application. The
Electronics Forum | Mon Aug 26 20:31:34 EDT 2002 | davef
Yes, it is quite common. Does it [refraction] provide adequate resolution? => Depends on: * What you mean by �adequate�. * When during the process [cleaning solution life] you make the measurement. Is the [refraction] measurement affected signifi
Electronics Forum | Mon Dec 24 01:43:34 EST 2001 | sanmatech
Recently started running flex board with tin lead connectors. The problem being that when we receive the parts incoming connectors are all bright and shiny. Now after going thru the heller we encountered cold solder. At this time peak temp was at 186