Electronics Forum | Fri Jul 02 13:35:52 EDT 1999 | rick
| | I know this is not so much a technical question, but it didn't fit in the Admin Center either! | | | | I was doing some research on screen printers and found a listing in the 1999 SMTA directory for de Haart Technologies in MA. | | | | Are the
Electronics Forum | Wed Jun 30 17:58:01 EDT 1999 | Boca
| My guess would be trapped flux continuing to be active after soldering. Is the tarnish there immediately after exiting the machine? Do you remove the mask and wash right away? If the solder is reflowing under the mask on the component side it wo
Electronics Forum | Tue Jun 29 18:35:59 EDT 1999 | JohnW
| | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | Leaching. Dissolution of a metal coating into liquid solder. Nickel ba
Electronics Forum | Mon Jun 28 12:51:08 EDT 1999 | Scott Cook
| Anyone having any conveyor rail shaking on Electrovert wavesolder machine model "Electra"? The conveyor shakes more with a pallet passing through the machine, particularly when the 20" pallet is passing from spray fluxer to the first pre-heater. He
Electronics Forum | Fri Jun 25 03:16:38 EDT 1999 | Scott Davies
Wayne, Earl, I wish there was some way we could toss our wave solder machine forever! Unfortunately, we haven't found a way yet to do paste-in-hole reflow for large numbers of thru-hole axial and radial components, which we insert on Universal machi
Electronics Forum | Fri Jun 25 12:07:00 EDT 1999 | John Thorup
| | hello, | | | | has anyone tried dispensing solder paste in thru holes instead of waving or hand soldering. if so how did it work out for you. | | thanks for the input | | | | wayne | | | | | | | We have tried this mainly on thru hole connect
Electronics Forum | Fri Jun 25 08:44:01 EDT 1999 | Graham Naisbitt
| We are anticipating switching from RMA to OA flux for both reflow and wavesolder in the next few months. If you use a batch cleaner running DI water only I would like to hear your experiences. How is it for cleaning under low standoff components
Electronics Forum | Sun Jun 27 06:27:15 EDT 1999 | Vic Lau
| I am looking for a way to clean solder off of QFP packages. I'm thinking a chemical method would be easy, as long as the chemistry doesn't attack the leads themselves, or the package. | Any suggestions? | Dear Matt, I have a customer, who is com
Electronics Forum | Mon Jun 28 14:36:34 EDT 1999 | John Thorup
| | I am looking for a way to clean solder off of QFP packages. I'm thinking a chemical method would be easy, as long as the chemistry doesn't attack the leads themselves, or the package. | | Any suggestions? | | | Dear Matt, | | I have a customer
Electronics Forum | Thu Jun 24 09:57:44 EDT 1999 | Vic Lau
Dear guys, I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now using a no
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