Electronics Forum: can (Page 658 of 2411)

How to prevent Bluetooth Module BGA short anybody?

Electronics Forum | Tue Dec 06 06:14:38 EST 2005 | bwet

Try using some of those new polyimide stencils. They are 8mils thick and can prevent shorting if it is due to solder mask problems or too much paste. http://www.solder.net/technical/tips.asp BWET

Jars versus Cartridges

Electronics Forum | Wed Nov 23 12:23:24 EST 2005 | jdengler

-Cartridges will fit an auto dispenser on the screen printer or a hand dispenser. Will waste some paste at the bottom of the cartridge. -Jars will be a little harder to deal with. They are messy. Can get all but the last couple of grams of the pas

Solder Paste Voids

Electronics Forum | Wed Nov 23 15:02:38 EST 2005 | tglenn

We are using AIM WS300 solder paste and are experiencing excessive voiding on our BGAs. We have exhausted reflow profile alternatives and just can't beat the voids. Has anyone had success with this paste on BGAs? If so how?

HELP ON SANYO TCM-V822 HIGH SPEED MOUNTER

Electronics Forum | Wed Nov 30 20:38:31 EST 2005 | CEB

You can contact Hitachi High Technologies America, they are still supporting these machines (972-615-9102). It also sounds like you could have a servo problem.

Antistatic

Electronics Forum | Thu Nov 24 05:56:32 EST 2005 | mskler

We are using QFP & other IC's in SMT but not using the antistatic pecautions. I want to know that what effect can be on IC's in future. Because we did not get any IC damege immidiatly. How long after this will affact the IC,s.

Samsung CP45?

Electronics Forum | Tue Nov 29 16:50:24 EST 2005 | Larry Davis

Sean, We have 3 CP45's installed and have been running for over a year. I can give you plenty of feedback, good and bad. Give me a call if you'd like. Regards, Larry 970-663-1377 x2774

USING LEAD FREE PARTS WITH LEAD PASTE

Electronics Forum | Mon Dec 12 13:13:34 EST 2005 | Kris

Mika Can you please share the manaufacturer name or links to the documents that you have with this restrictions ?

USING LEAD FREE PARTS WITH LEAD PASTE

Electronics Forum | Thu Jan 05 12:26:20 EST 2006 | Rob

The larger BGA's can also warp more under higher temperatures which causes ball lift, more noticable towards the edges of the package.

BGA inspection microscope

Electronics Forum | Sat Dec 03 16:26:40 EST 2005 | grantp

Hi, I have seen demos of these scopes, and don't think they really show you very much. If you profile your board right, and drill up to solder a thermocouple onto the inner balls of the device so you really know your getting a good profile, I don't

BGA ball Separation

Electronics Forum | Mon Dec 05 12:41:40 EST 2005 | stepheniii

thermal cycling chemical reactions (can occur slowly) they were only touching before and not really a solid solder joint


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