Electronics Forum | Tue May 02 16:33:18 EDT 2000 | Joe
hi, I am looking for some guidelines which can tell me when gullwing and finepitch leads are too damamged to repair. Copper gets hard when bent and the electrical resistance increases. When a finepitch component gets dropped a lot of pins need staig
Electronics Forum | Tue May 02 15:29:14 EDT 2000 | M. F. Roe
I am looking for public papers or articles on intermetallic formation as a function of reflow profile. Most solder paste vendors specify peak temperature and time above liquidus, but I am particularly interested in what happens to intermetallic grow
Electronics Forum | Tue May 02 13:14:08 EDT 2000 | Bob Paniaha
Angelo, I have a few questions for you? 1. What version of software are you using? 2. Do you remove the tape feeders from the base before optimizing in the software? This must be done or it will leave the feeders where they were, which will degrade t
Electronics Forum | Tue May 02 13:29:13 EDT 2000 | Stefan Witte
Hallo Erhard, this appears to be a common task for the manufacturer of taping machines. These machines pick from a bowl feeder or from a wafer and place into tape or tray. Check Ismeca, Viking and others. If you are looking into a custom made solutio
Electronics Forum | Sat Apr 22 13:54:02 EDT 2000 | JAX
What's Up Big Man, Although I agree with a few things Dean said, personally I like back-light. But since you probably won't listen to me here's is the suggested info: Lead_check area= 60% Vision type= 120 P_pattern= 34 This rest is part dependant
Electronics Forum | Thu Apr 20 13:02:44 EDT 2000 | Robert Patrick
Hi.... I read your message and can empathize. I just joined PDR Infrared Systems. PDR offers an Infrared System for CSP/UBGA with X-Ray or Optical Inspection Packages. You may want to consider IR technology for UBGA before taking the plunge. Hop
Electronics Forum | Thu Apr 13 13:02:03 EDT 2000 | Paul Peterson
Hi fellow problem solvers,... We suspect a planarity problem with our 6 mil wide flex circuit pads having height variance of up to 2 mils after print and reflow. This is contributing to a placement skew with our TAB bonder... Has anyone had any succe
Electronics Forum | Thu Apr 13 07:30:09 EDT 2000 | Christopher Lampron
I agree with Nick. You should check with the manufacturer to determine what type of plating is used on the components and see if the manufacturer has any recomendations on materials that may help. If no exotic materials are used, the culprit is most
Electronics Forum | Thu Mar 16 07:02:38 EST 2000 | Scott Davies
Does anybody have any experience or knowledge of processing PCB assemblies featuring pyroelectric sensor devices, the type used in Passive Infra-Red Sensor modules? Since these devices are, by definition, very sensitive to heat, how do you get round
Electronics Forum | Tue Mar 14 05:02:35 EST 2000 | emmanuel
I am to implement PBGA, and i am looking for PCB surface finish informations. A lot of technical reports are specifing NiAu finishing because of flatness property. Because of leads shape, I though that BGA doesn't need flat pads like QFP. Is it false
