Electronics Forum | Tue May 26 07:46:26 EDT 1998 | Peter H. Cote
We currently bake plastic SMT parts in accordance with the IPC guidelines for moisture sensitive parts. Because we have double-sided boards that are subjected to either an aqueous or semi-aqueous cleaning process, we do a 24 hour bake at 125 deg. C
Electronics Forum | Tue May 26 13:01:40 EDT 1998 | Earl Moon
| Regardless of what various inspection standards state, has anyone got any information on how the strength of a soldered joint changes with the amount of solder in contact with the legs. ie if there is 0.152um depth of contact how does the joint st
Electronics Forum | Fri May 22 22:18:18 EDT 1998 | David Newman
Hello, I am looking for suggestions for cleaning pcb's after the routing (fabrication) process. Keep in mind that these pcb do not have components intalled on them yet. We have considered pre-drilling the routing plunge points, but cost and capacity
Electronics Forum | Tue Jun 09 17:01:02 EDT 1998 | Earl Moon
1/8" cutters, although they can only be used | with our newer height-controlled machines. | 3. Reduction of operating parameters. Reduced Z-axis plunge rates for the | larger cutter sizes. | 4. Addition of a 1/2 sec. dwell at the plunges. The small
Electronics Forum | Tue May 26 13:04:08 EDT 1998 | Gary Simbulan
| Recently there was a thread on soldering paladium leads on ICs. A gent from TI suggested an article he had written. Various folks suggested making sure the reflow profile peaked above 215C. | My question is: How does one recognize paladium leads
Electronics Forum | Sun May 24 08:24:29 EDT 1998 | Dave F
| | My question is: How does one recognize paladium leads so that the profile can be set properly? | | Dave F | Hi Dave, | It's kinda' subjective, but what I think it looks like is almost like having a nickel appearance to it, it's smoother and
Electronics Forum | Fri May 22 07:59:14 EDT 1998 | Jerry
We are currently comparing the Fuji QP2 machine to the Universal GSM. The primary use will be for QFP's down to .4 mm pitch and for 300+I/O BGAs. My initial input has been that you spend alot of time tweeking PD's on the QP because the vision syste
Electronics Forum | Thu May 28 22:02:09 EDT 1998 | Ian Bates
Jerry, I have been using the QP in a Proto and Production environment for about a Year and once the PD is Created(which may take some time) and vision processes. I rarely ever need to make further changes. As far as BGA Pd's. They are a Little
Electronics Forum | Thu May 28 18:16:40 EDT 1998 | Ian Bates
| We are currently comparing the Fuji QP2 machine to the Universal GSM. The primary use will be for QFP's down to .4 mm pitch and for 300+I/O BGAs. My initial input has been that you spend alot of time tweeking PD's on the QP because the vision sys
Electronics Forum | Thu May 21 22:07:47 EDT 1998 | Mike Konrad
I am a former employee of a drag soldering machine manufacturer. For years they attempted to devise a method of soldering surface mount devices via the drag soldering machine. Bridging was the largest problem along with component damage due to exce
