Electronics Forum | Wed Dec 23 12:50:38 EST 2009 | stepheniii
Make sure you(not someone simply telling you) check that the components are actually on the board before the wave. I think we had a thread once that started with someone saying they had parts falling off in the wave and ended with the person saying
Electronics Forum | Thu Jan 29 15:27:54 EST 2015 | markhoch
I agree with SWAG on this. Nano Coatings make a big difference on paste release. I found when placed on the topside of the stencil, it also helps to reduce stencil wear, though others complained that it affected the solder roll, so most stencil house
Electronics Forum | Thu Sep 10 10:04:27 EDT 2015 | emeto
1. Automated optical inspection(this is a machine that checks for you using camera and software algorithms for recognition) 2. Electrical test. For any PCB a test device can be made. A standard one will look like this: Put the board in the device. Go
Electronics Forum | Thu Sep 29 18:57:14 EDT 2016 | vchauhan
Is it ok to re-print the mis-print PCB? Personally I am oppose to re-print the mis-print board. For two reasons. 1. You will end up adding solder paste on the bottom side of the stencil. 2. You may smear solder paste in some area. But I would like to
Electronics Forum | Fri Jun 23 12:54:53 EDT 2017 | guts1872
We are having issues with top fill and dropping pins on Molex connectors with our KISS 101. Unfortunately we do not have a pre heater and bottom side pre heat with our nozzles is not satisfactory. Most of the issues occur when using a no clean proces
Electronics Forum | Thu Jan 04 02:54:20 EST 2018 | buckcho
Hello, I have experienced the same problem. It is a problem with your PCB manufacturer. If the paste goes away from the pads it is most likely PCB problem. How long does it take to produce from top to bottom side? The longer it takes, the worst the p
Electronics Forum | Fri Apr 26 05:50:54 EDT 2019 | ppcbs
We just apply tacky flux to the surrounding components and to the bottom side components under the BGA. This will prevent cold solder if any solder joints reach reflow temperature the surface tension will keep them aligned and in place. If you nee
Electronics Forum | Tue Feb 04 14:03:13 EST 2020 | dekhead
As long as pressure is set properly (may require re-adjustment when adding / removing modules) then have not seen / heard of issues with damage to bottom side components. This assuming that rubber tips are in place and in good shape. I have a custome
Electronics Forum | Mon Nov 22 22:16:18 EST 2021 | dontfeedphils
From what I remember it was pretty easy/straightforward. I'd grab an image of the bottom side of the panel from our AOI, scale it, and load it into the offline programming suite. Program flux and solder paths, then iron out the kinks online during th
Electronics Forum | Tue Jan 24 11:07:41 EST 2023 | poly
Emtimov, what are you using instead? Hand soldering? Is the repeatability due to lacking bottom side fiducials or is the process just inconsistent? We've got a few connectors, something like 20 jacks with 3 pins each on some of our products. Our ma
