Electronics Forum | Tue Jan 17 16:43:03 EST 2006 | davef
If you are not washing and want to stay with a peelable mask the two basic types are vinyl and latex. Although we've seen some silicone and urethanes, they cost more. * Do not use latex peelable solder mask with a low residue soldeing process withou
Electronics Forum | Fri May 15 19:08:25 EDT 2009 | jlawson
Ammonia based masks can create solderability issues after they are removed. You can get non-ammonia based latex mask material but down side is slower cure and cost a little more as they have higher levels of latex etc
Electronics Forum | Fri Mar 02 09:08:10 EST 2001 | markkrmp
Frank, I am not talking about the masking on the PCB. I am actually talking about the masking on the solder side of the BGA. We have a very very high dollar BGA and are trying to reclaim alot for reuse. When we remove the BGA from the assembly, you
Electronics Forum | Wed Sep 20 12:43:40 EDT 2000 | rcroteau
RF pcb is all gold with no typical land patterns and multiple surface mount components sharing the same pad. IPC-610-B doesn't speak to inspection criteria. The problems I'm seeing are, insufficient solder, skewed components. Some of the pads have
Electronics Forum | Sun Jun 04 08:49:58 EDT 2000 | Roni Haviv
Hi C.K. , You can ask your PCB manufacturer to cover all vias with solder mask from CS (It called "pluged" vias). It's done from one side to prevent any close area that can cause "eraption" of solder because of pressure under reflow. All our boards
Electronics Forum | Mon Apr 16 12:31:27 EDT 2001 | mparker
If, after all the good advice already given, the engineer insists on following his wacky design, you may still be able to influence some success. First you have the fab house plug the via holes with solder then you make sure that the bottom side of
Electronics Forum | Thu Oct 28 09:25:35 EDT 1999 | Dave F
Chris: Typical non-wetting causes are: * Poorly controlled soldering process * Incorrect material * Surface contamination * Insufficient preheat * Misapplied solder mask * Shadowing Without intending to insult you, all of the causes of non-w
Electronics Forum | Wed Sep 08 17:28:11 EDT 1999 | Earl Moon
| | Has anybody have any experience with Top placement of BGA's. GLue descretes on bottom and then wavesolder.? | | | | | | | Hi Chris, | Why don't you process a double side reflow and use selective wave fixture for wave process. The process w
Electronics Forum | Wed Jan 28 20:58:16 EST 2004 | davef
Vinny: From a thermal standpoint, your choices are: * Get your customer to design thermal relief in the board. * Set your thermal recipe to assure that the grounded pad reaches reflow temperature. This may require a long soak at a single temperature
Electronics Forum | Mon Aug 09 17:02:32 EDT 2004 | arminski
Hi Shean, Thanks for the analysis. "Your product looks like it may have non-solder-mask-defined pads." Yes. It is a NSMD PCB. "Does there appear to be any residues on the bare boards, and/or, BGA components prior to applying the solder paste?"
