Electronics Forum | Thu Apr 20 22:46:26 EDT 2006 | samir
Amol, I thought I answered your question in another thread, dude! Anyway, to re-iterate. Yes, I was able to pull it off a hybrid profile. The LF BGA passed tensile testing, but no, it wasn't thermally cycled or stressed first to expose any latent
Electronics Forum | Mon Apr 05 14:25:56 EDT 2010 | krish_bala
Hello Bob, What makes this problem even harder for us is that we are not the manufacturer of this particular board. We are just performing re-works on them based on the issues they come in for, and thus refurbishing the unit. We are currently in th
Electronics Forum | Sun Apr 25 17:30:25 EDT 1999 | Mohammad Yunus
| | | | We are just starting to manufacture a PCB with a .039" fine-line PBGA. We are currently seeing voids, mainly in the center, that are as much as 45%. We also intermittently see the corner balls of the PBGA smaller than the center balls. We are
Electronics Forum | Fri May 29 17:19:54 EDT 1998 | Earl Moon
| | | | Thanks Steve- | | Here is the whole story: | | | | The solder balls are appearing all over, similar to a | | splatter. They are relatively small. We are using H-Technologies | | S-HQ no-clean solder paste. The stencil is 6 mil and the
Electronics Forum | Tue Jun 09 07:35:23 EDT 1998 | Steve Gregory
Hi there Gary, Your solder ball problem is very similar the problem I experienced, but I was using a water soluble paste at the time. It started by inspectors telling me that they were seeing cold solder on some SIMM's that we had built regularly. W
Electronics Forum | Fri Dec 22 16:04:26 EST 2006 | mika
Hi, This Not so easy as one wuold think. Has the thermal pad of yours vias? How many? What's the via's dia? What is the pcb thickness? If the the pcb has a "ground layer" connected (vias) to the pcb thermal pad, it could sometimes be a little bit tri
Electronics Forum | Tue Dec 21 17:58:44 EST 1999 | Brian W.
When doing PIH processes, it is critical that you control the solder VOLUME, not the height. You must define the process, monitor it and control chart it to keep the paste volume consistent. You have do some careful engineering to determine how muc
Electronics Forum | Mon Oct 25 14:48:29 EDT 1999 | William
All, I am having a problem with joints being soft after SMT. Especially 25 mil and smaller parts. It seems as though you can slide the leads right off of the solder. It takes only about 30-40 oz. of compression at 45 deg. to move leads off of join
Electronics Forum | Sun Jun 06 08:00:06 EDT 1999 | Dave F
snip | Ryan, | | The only advive I got is just don't do it!. Dave's right the grain growth in it is pretty bad. the other thing you got to look at is how much heat is the board gonna produce in it's working life..??? and where is it gonna be used,
Electronics Forum | Fri Apr 23 12:26:27 EDT 1999 | Jeff Anweiler
| | I would like to known what�s MESH SIZE mean in the solder paste specification ? | | | | | Check out the thread from 4/14/99 on solder FINES vs. solder balls. The info you're looking for is in there. | "Mesh Size" is a term that is commonly use
