Electronics Forum: /02 (Page 665 of 1283)

Solder Balls

Electronics Forum | Thu Feb 01 12:50:38 EST 2001 | slthomas

I side (not that we every actually choose sides here) with the other poster re: reducing solder volume. There is a solder manufacturer that advertises regularly in trade mags. that there are "Absolutely! NONE....NIL....NADA.....mid chip beading/mic

Solder at gold finger

Electronics Forum | Thu Feb 01 20:21:34 EST 2001 | huat

Hi, Currently, we use kapton tape to tape out the goldfinger at our area. We still experience solder at goldfinger area, suspected is from washing of misprint boards. Can someone advice me on what is the method being use to clean the goldfi

Solder at gold finger

Electronics Forum | Mon Feb 05 20:33:14 EST 2001 | davef

Could you be trying to find: Stevens Products 128 N. Park St E Orange, NJ 07019 973.672.2140 Ross Stevens? Dynamic Technologies (titanium cover w/ silicone jacket, pricey) Stevens makes a U-shaped strip of fiber-material that slips over gold fing

Solder Pot Temperature

Electronics Forum | Mon Feb 05 11:43:00 EST 2001 | dason_c

PeteC, thank you very much for your great information, I did implement some of our facilities to use 250C but still some of the other facilities are still set at 260C. I am not only consider the warpage but also the power consumption, dross, PM, pot

component attrition

Electronics Forum | Tue Feb 06 10:55:58 EST 2001 | pjc

Larry, Our specification is 0.075% for our Fuji CP3 and IP2 machines. At or above that figure the Maintenance Dept. has to get to work. We typically see 0.03% to 0.05% on average. The Fuji machines are all vision centering. We have found feeders are

Placement accuracy

Electronics Forum | Tue Feb 06 11:07:43 EST 2001 | cjrjmj

I am looking for some assistance with placement accuracy studies for chipshooters(Fuji CP4-Cp642) and platform machines (GSM all configurations, Siemens HS50/S25). I would like some information on companies and recommendations on process of evaluatin

Placement accuracy

Electronics Forum | Wed Feb 07 12:56:00 EST 2001 | jax

I' ll have to agree with Dave on this one. Just get the information from the Suppliers. The Glass plate, Aluminum board, Glass slugs, etc... are all used to determine if a calibration is needed or if it was succesful.( they can also give you offset i

CM in Brazil

Electronics Forum | Wed Feb 07 21:57:18 EST 2001 | davef

Is ... Marcio Pavageau, a Brazil native and former executive of IBM Brasil Ltda., has been appointed managing director of Pemstar Brasil Ltda. Pemstar 313535 Technology Dr. NW, Rochester, MN 55901; (507) 288-6720; Management: Al Berning, chairman, p

PCB Gold Plating

Electronics Forum | Wed Feb 07 21:51:49 EST 2001 | davef

You're correct that some folk have used microns and other folks have used u" when discribing their ENIG specification. It's likely the the micron folks misquoted their units and it's arguable that participants in the forum should have taken them to

PCB Gold Plating

Electronics Forum | Wed Feb 21 19:46:13 EST 2001 | Dave E

u" are smaller. 1uM = 39.4u" and so 3-7uM = 118-275u" Then some articles or specs really confuse things by mixing mm and uM or using u all by itself... http://www.circuitree.com/CDA/ArticleInformation/features/BNP__Features__Item/0,2133,11666,00.h


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