Electronics Forum | Tue Oct 22 14:57:18 EDT 2002 | Jim M.
I use a water soluble flux to solder an LCD into gold plated through holes of a .031 circuit card. Problem is the current water soluble flux (850-33) is not made anymore (the drop in replacement has a different formuala and does not work). The main i
Electronics Forum | Tue Oct 22 15:32:09 EDT 2002 | ruppertg125
We are a military contractor and need to build to IPC610 class3. We are receiving many parts with palladium leads and currently use a No-clean solder paste. We have evaluated OA pastes with very little improvements. Without a touch up of all leads th
Electronics Forum | Wed Oct 23 16:17:17 EDT 2002 | nwyatt
CSP is similar to BGA process in that you need to undergo a reflow process to properly solder the chip. Also, a soak period is desirable to promote outgassing. You do not need nitrogen. We are building CSPs in a regular convection oven without n
Electronics Forum | Thu Oct 24 15:35:47 EDT 2002 | davef
Biological Oxygen Demand (BOD). A test that measures how much of the oxygen dissolved in water is consumed by biological oxidation of the chemical in the water during the stated period of time. [Water from an exceptionally clear lake might show a BO
Electronics Forum | Fri Oct 25 11:21:05 EDT 2002 | soupatech
This may sound like a stupid question but keep in mind I am very new at this and most of the training I have recieved has been from operation manuals and this forum (thanks to all). Our purchasing agent (new hire) is ordering a stencil for the first
Electronics Forum | Sat Oct 26 08:01:17 EDT 2002 | davef
IIT is a reputable supplier. They will be more than happy, happy to help a newbie get a good product. Continuing, at one level of product design sophistication ordering by remote will provide you with a perfectly acceptable stencil. But on the o
Electronics Forum | Wed Oct 30 09:16:51 EST 2002 | russ
Low air flow huh. This is interesting, I have a low end machine that has adjustable air flow and I was having some shorting problems awhile back (corners mostly) and my first attempt was to preheat the board up to 170C and then use lower temp to put
Electronics Forum | Mon Oct 28 07:07:39 EST 2002 | cyber_wolf
It has been my experience that when all conditions are as they are supposed to be there should be zero or very little deflection. When you start placing components with pick and place equipment that does not have a Z pressure sense, you run the possi
Electronics Forum | Mon Oct 28 18:59:25 EST 2002 | tkenny007
Specs for Bow and Twist for PCBs (IPC-A-610C, 10.6. There may be an update by now). I also have a note in our quality guide referencing (IPC-TM-650, 2.4.22) and (MIL-STD-105D). In summary, a PCB should not bow more than 0.040" with all four corner
Electronics Forum | Tue Oct 29 15:07:38 EST 2002 | gregp
SOP small outline package, SOIC small outline integrated circuit, VSOP very small outline package, TSOP thin small outline package,TSSOP thin shrink small outline package, QSOP ???, LQFP low profile quad flat pack, VQFP ??? The packages come and go
