Electronics Forum | Wed Nov 20 16:53:18 EST 2002 | davef
Q1: How important is the bare PCB baking ? A1: Baking boards is a non-value added activity. Q2: What is the temperature for baking @ what RH ? A2: Search the fine SMTnet Arcives for bake recipes. Q3: What would be the impact for the ENTEK finishe
Electronics Forum | Wed Nov 20 21:04:15 EST 2002 | yngwie
Hi Dave, What do you mean by "if the board is manufactured properly". If the board is not manufactured properly, humidity will have an impact on the peel strength? Is that what you mean. How does the Humidity impacted the peel strength ? Thru' which
Electronics Forum | Sat Apr 26 01:50:17 EDT 2003 | jojojameson
Dear All Our company as a group is known as NeST Group of companies.We started our activities in the feild of electronic manufacturing in the begining of 90's.Now we have operations in all range of activities in software development,hardware design &
Electronics Forum | Fri May 09 17:47:37 EDT 2003 | slthomas
I think medical manufacturers are more inclined to proceed with caution because they have so much more at stake when something fails out of the box, or worse yet during a code. A lot of them locally have gone outside for pcb assembly, but stayed dom
Electronics Forum | Thu Nov 21 07:57:37 EST 2002 | gramsey
The information you are seeking is found in IPC-7525. Section 3.3 describes an equation for calulating the solder paste volume required to produce a desireable fillet. I simplified it a bit. V=1/s[Tb(Ah-Ap) + Ft + Vp] - Vh V is the volue of paste
Electronics Forum | Mon Dec 02 09:47:54 EST 2002 | davef
Most modern spec do not distinguish between process methods. So, there is no allowance "if you are using bla bla bla method, you should see ... . But if you are using bla bla de bla method, ignore that and look for ... ." Most specifications requi
Electronics Forum | Wed Nov 20 18:41:57 EST 2002 | slthomas
Here's part of what I could read: "We evaluated the influence of Lift-off (Fillet-lifting) and the influence of thermal fatigue, in this case on combination between various terminal platings of electronic components and Pb-free solder, Sn-37Pb solde
Electronics Forum | Fri Nov 22 10:18:33 EST 2002 | Joaquin Rodenas
Dear Mr. Liang I'm a service ingeneer in a distributor of FUJI products. My first suggestion is get some help from the FUJI dealer in your territory, but anyway try the following: First of all, check again the FTP tool included in F4G-main windows
Electronics Forum | Thu Nov 21 06:36:30 EST 2002 | Ben
I'm doing SMT of lead-free solder BGA on FR4 Ni-Au PCB. The solder paste I'm using is Sn/Ag/Cu and reflow with peak temp at 240C. I found there are voids(1-2) in almost every solder joint(500 micron in dia) under xray. And the void size is violate th
Electronics Forum | Mon Nov 25 07:58:27 EST 2002 | Yannick
Hi, I made a board wich I plated with immersion Tin, I tought it should be the same result as we had with tin lead but we ran into a weird problem. WE use a 63/37 no clean paste and on the Board with Immersion Tin the solder just make a ball ON
