Electronics Forum: electron (Page 6697 of 7893)

Placement machine comparison

Electronics Forum | Thu Jun 20 08:59:57 EDT 2002 | John Burris

I agree with some of the earier postings about checking other mfgs. Assembleon and Juki are really two different price point companies. Assembleon is more in line with the Panasonics and Siemens of the world, Juki and Samsung might be a better focus

Placement machine comparison

Electronics Forum | Mon Jul 01 21:25:14 EDT 2002 | jersbo

Have... Topaz and Emerald X inline (GEM series) very satisfied with thru-put and quality.. as well as tech support... have worked with other machines as well Fuji(3,4) Universal GSM series... and Europlacer(Multitronic) Best software goes to Univers

MELF component short togehter

Electronics Forum | Thu Jun 13 21:44:21 EDT 2002 | jkhiew

Hi all, * Defect : termial to terminal touching btw two melfs body that created short circuit. * Clearance : 0.8mm btw two melfs body. * Size melf : diameter=2.4mm to 2.7mm, length=4.8mm to 5.2mm * Stencil opening : "v" shaped to minimise component

performance improvement

Electronics Forum | Tue Jun 18 05:40:38 EDT 2002 | ianchan

Hi mates, finally! some sense to all this, so this bloke is concerned about "ppm = quality" variations... looking back through all the muck in this thread, last posting before the s**t hit the ceiling was: ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ Date: June

pcb plating

Electronics Forum | Fri Jun 14 14:30:36 EDT 2002 | davef

Assuming you are talking about solderable surfaces: People specify various materials to protect the solderability of the pads on the board. Gold, actually, Electroless Nickel - Immersion Gold [ENIG], is popular. * Board fabricators like it because

BGA excursion placed by IP3

Electronics Forum | Tue Jul 02 08:59:14 EDT 2002 | jax

On an IP3, from what I remember, the BGA Part data is defined from center part moving out towards part edge. If your pick up point is a little off this problem can occur. Otherwise, Check your gain and offset settings. The machine is probably recogni

Remove,Re-ball then Re-use BGA safely !!!

Electronics Forum | Thu Jun 20 15:50:04 EDT 2002 | dason_c

Dave mention b/4 to me, we don't have any industrial standard for the BGA rework. One of my customer request us to bake at 125C for 6 hours b/4 rework. I am lucky and we don't have the component which you are using. I did a evaluation and we found

Remove,Re-ball then Re-use BGA safely !!!

Electronics Forum | Tue Jul 02 09:29:08 EDT 2002 | dason_c

Ian, First, I baked the parts at 125C for 48 hours and check the weight Second, I soaked the parts above 30C and 60% for 96 hours and check the weight Calculate the weight gain, suppose only moisture add to the parts during soaking, say a Third, dry

Remove,Re-ball then Re-use BGA safely !!!

Electronics Forum | Tue Jul 16 01:28:48 EDT 2002 | ppcbs

Our BGA Rework process has resulted in 100% yield. We always bake BGA chips at 125 degrees C for at least 8 hours before installation. We always bake loaded boards at 90 degrees C for at least 12 hours before BGA removal. Any parts that went throug

Amistar Support

Electronics Forum | Thu Jan 22 10:36:55 EST 2004 | Miguel Sangabriel

I am looking to create a "User Group" for Amistar > equipment. We are a midwest contract > manufacturer with several Amistar placment > machines. With the recent departure of Qualmax as > an I-Pulse distributor, users in the US are left > with f


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