Electronics Forum: electronic (Page 6708 of 7895)

Refreshing PCB Solderability

Electronics Forum | Wed Aug 14 16:44:54 EDT 2002 | dragonslayr

What is the surface finish? HASL, Entek? what? If HASL, ask your fab supplier for recommendations, maybe even rerun the boards through the HASL process. The fab house would have to strip off the old coating and reapply. Just a thought, depends on y

Baked Components

Electronics Forum | Thu Aug 15 22:35:54 EDT 2002 | Brandon

I've done some experiments on baking parts as we got pop corning QFP's on our production line. This QFP has moisture level of 5 and I baked them @ 125'C for minimum of 12 hrs. So far results were great but I have a question: Forum says that I cannot

component baking

Electronics Forum | Fri Aug 16 11:13:17 EDT 2002 | kenbliss

I have a question for everyone about component baking. In my view this is rework. The component was manufactured and shipped correctly and should not need baking in order to use it. Some how in storing the component in a stockroom atmosphere (I as

component baking

Electronics Forum | Fri Aug 16 18:23:48 EDT 2002 | kenbliss

Hi Dave Interesting points. If I understand you correctly 1. about 2% of part numbers have a moisture problem 2. Packaging frequently comes in with expired dates on them. This seems hard to believe you would accept them. 3. To really solve the

component baking

Electronics Forum | Tue Sep 03 18:14:35 EDT 2002 | fmonette

I have never heard about a requirement for temperature ramp-up for baking components at 125C. In general the concern for delamination with moisture sensitive components starts above 200C (peak body temp). Most important is you should bake your com

component baking

Electronics Forum | Thu Sep 12 11:50:58 EDT 2002 | stepheno

http://www.jedec.org/download/search/jstd020b.pdf http://www.jedec.org/download/search/jstd033a.pdf The above links are for JEDEC standards regarding moisture sensitivity. SMT magazine has an article a few months ago regarding a company that saved

Integration of manual odd form / low volume pick and place

Electronics Forum | Mon Aug 19 11:13:18 EDT 2002 | ksfacinelli

I would like to understand what different options people are using to place low volume / odd form parts. I am very familiar with the tweezers / vacuum pen method however this can be less than desirable. I am looking into a manual pick and place to

Integration of manual odd form / low volume pick and place

Electronics Forum | Wed Aug 21 18:13:21 EDT 2002 | johnlee

Kevin, There are a number of custom integrated systems that perform automated insertion of "odd" components. These system use either a robot or cantilevered X,Y,Z Cartesian motion systems. Our systems have accepted standard and custom component feede

50 PPM

Electronics Forum | Wed Aug 21 02:11:58 EDT 2002 | kenbliss

Hi Joseph It is not clear what you want us to comment on, however I will take a shot. 1. If the boards you are assembling are expensive it may make sense to strive for 50ppm. 2. If the boards are not very expensive, in my experience you would be

50 PPM

Electronics Forum | Wed Aug 21 17:50:05 EDT 2002 | davef

First, it�s GREAT that your defect rate of 282 is very close to your Boss� goal of 50 ppm. Second, your Cpk and your ppm numbers don�t tie out with our expectations. You say Cpk for: * mounter is 1.0 and �your mounting is 83ppm�. * printing is 1.33


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