Electronics Forum: electronic (Page 6723 of 7890)

0603 - stencil thickness

Electronics Forum | Thu Jan 09 10:47:36 EST 2003 | Hussman

Depends on what you mean by shifting towards each other. Otherwise, 7 mil should be fine for 0603. I've used 6mil, 7mil and 8 mil without problems. Generally, stencil thickness won't have a bearing on "shifting" parts. Check placement. Make su

Capability Process CPk

Electronics Forum | Fri Jan 17 04:07:12 EST 2003 | iman

A) Paste Printer : A1) identify the critical SMDs' pads. (choice should go to the BGA, CSP, MLF types...RES,CAP last in line...) A2) get a Paste measurement machine that measures readings of paste height (or better - volume) you are paste printing

Capability Process CPk

Electronics Forum | Fri Jan 17 16:24:04 EST 2003 | MA/NY DDave

Hi I haven't seen the DEK software you describe in action or studied it, yet I will tell you to be careful of some of the software on the market even from good companies. Spend the time needed to understand how the software makes the calculations,

Capability Process CPk

Electronics Forum | Fri Mar 07 20:52:51 EST 2003 | Neil

With any kind of statistical study you must have some limits to which you can measure against. The whole purpose of generating a CPK is to ensure that the equipment under observation can meet these limits when used under normal operating conditions.

Rework Station

Electronics Forum | Thu Jan 09 16:42:50 EST 2003 | russ

what are your grading criterias? All of these work pretty good but have differences in the "bells and whistles" I like the Air-Vac DRS24 (no exp. with the 22) because of the large under heater and thermo-couple control. but it is very slow and costl

Rework Station

Electronics Forum | Fri Jan 10 09:38:00 EST 2003 | pjc

Without knowing your boards and components its difficult to comment- beyond users of those mfgs. and models you mention commenting on performance, reliablity of the equipment and service & support from the mfg. As with any machine, its best to test d

Direct Chip Attached & Flip Chip

Electronics Forum | Fri Jan 10 08:52:31 EST 2003 | nifhail

We are typical SMT subcontracting house. Recently I received RFQ for brds with DCA or Flip Chip technology. In our factory we only have typical SMT machines i,e Printer-HSP chipshooter-GSM IC placer-reflow oven. What are additional machines and pro

Direct Chip Attached & Flip Chip

Electronics Forum | Thu Feb 06 14:27:18 EST 2003 | MA/NY DDave

Hi You already have some good answers. Let me add just a little of what I know. You might want to check the IPC and obtain their guides on this technology. Also SMTA, NEPCON and others have technical proceedings on this technology. Checking with e

Making a BGA stand up

Electronics Forum | Mon Jan 13 06:28:15 EST 2003 | johnw

Hi folk's, I'm looking for some help full suggestions here... I've got a ceramic BGA with tn/lead / bismuth balls on it that is over collapsing due to the weight of the momponnet vs the ablity of theball to suppot them. We've spok eto the component

Making a BGA stand up

Electronics Forum | Mon Jan 13 16:24:15 EST 2003 | russ

Youch! I know this is going to sound stupid but.... I have done it in the past in limited quantities. We placed capton (polyimide) tape at each of the four corners for a similar situation. It did work but the operator has to be careful in placing


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