Electronics Forum | Thu Jan 16 15:16:52 EST 2003 | Mike Konrad
You are comparing apples to oranges. No-clean fluxes, because they are designed not to be cleaned off after reflow, contain very low solids. Normally, no-cleans have a solids content of 2% - 5%. Your basic RMA has a solids content of 15% to 30% (s
Electronics Forum | Thu Jan 16 15:55:31 EST 2003 | MA/NY DDave
Hi I have a funny feeling that Mike Konrad and I know each other from IBM-Endicott days, yet I could be wrong. It would be funny?? Mike gave a good answer. The Rosin or Rosin Mildly Activated Flux (RMA) if on the board at ICT (In Circuit Test) wil
Electronics Forum | Thu Jan 16 18:14:35 EST 2003 | jonfox
You can still get support. I was in that deal before Tyco decided they didn't need Multitronics field engineers playing with Quads. Anyway, most of the original Quad personnel are stil running service. Based by region, in the West or Central US, c
Electronics Forum | Fri Jan 17 15:36:23 EST 2003 | davef
How do 0.5 mm pads on the board help paste release from the stencil? Paste release from the stencil is a function of: * Paste * Printer operation * Stencil design You have no obligation to made your stencil apertures the same size as the pads on yo
Electronics Forum | Fri Jan 17 21:17:18 EST 2003 | Grant Petty
Hi, Our paste release problems have been solved, and we worked on the stencil, and things are working well now. However this board was designed before we knew what was going on, and we thought a little more size on the pads would be a big help. Is
Electronics Forum | Mon Jan 20 13:51:12 EST 2003 | slthomas
I seem to recall seeing some references to controlling the time above 205�C as a critical parameter, although I can't find it in the archives anywhere other than one reference to a maximum of 45 seconds. What's ideal (typically....I realize differen
Electronics Forum | Mon Jan 20 17:42:45 EST 2003 | jonfox
Double check the data sheets for your paste. Just as an example, ou Indium paste has a recommendation for the Heating, Liquidus, and Cooling stagees of reflow. They recommend a linear ramp up of 0.5 to 1.0 degree C. In the Liquidus stage, a peak t
Electronics Forum | Mon Jan 20 22:39:46 EST 2003 | davef
Hi Stevo, Most paste suppliers say something like, �above 183*C for 45 to 60 seconds.� The problem we have with statements like that is that they seem to assume that the pads, component leads, and solder paste are all near eutectic 60/40 solder. A
Electronics Forum | Wed Jan 22 13:17:48 EST 2003 | slthomas
We're considering stenciling SMT adhesive to increase throughput. This is an as-of-yet unproven process and for that matter pcb design (we've never done anything with more than about 50 SMT parts on the bottom, this board has in excess of 1200, but
Electronics Forum | Wed Jan 22 16:17:27 EST 2003 | slthomas
Ya know, I got that thing because I was told, once upon a time, that besides some typical low density passive bottom sided stuff, we'd eventually be building products with SOJ's and QFP240's on both sides and short of hand dispensing big tall gobs of
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