Electronics Forum | Tue Nov 14 08:17:09 EST 2006 | Rob
Degassing - the air in the void above the electrolyte expands, or in some cases the electrolyte vapourises, blowing the top of the cap from the base. Sometimes electrolyte can also leak out around the base seal. This is also a failure as the cap wo
Electronics Forum | Wed Nov 15 11:42:37 EST 2006 | AndyGAC
I work for an electronics manufacturing plant in North Carolina. We have a Teradyne Javelin 1004 flying probe machine, but we are looking for spare parts for it at a cheaper rate than our initial quote. Do any of you happen to know of any sites on
Electronics Forum | Mon Dec 11 17:19:12 EST 2006 | darby
Hi AJ, Thanks for the reply. I'm beginning to think that we have some issues with different expansion rates of the two pcbs. When you say you had some profile issues... Did you stay within the recommended UBLOX reflow time of 20 - 40 seconds and di
Electronics Forum | Tue Jan 23 23:28:54 EST 2007 | jovial_guy23
If you have flux deposits on the cooling plates, try out Zestron's VIGON RC101...It is an extremely good product especially for reflow ovens and wave solder systems. Check it out...Minimal maintenance water based chemistry with no flash point...Much
Electronics Forum | Mon Feb 12 13:15:14 EST 2007 | realchunks
Does this meet the SMQ230 recommended time above liquidous? Do you have any parts that cannot withstand 239 degress C? If meet SMQ230's recommended time and temps and your parts are rated for this temp, then you should be OK. The real proof is ref
Electronics Forum | Mon Feb 12 13:58:10 EST 2007 | campos
Tks for the answers,, My concern is about the intermetalic layer,,I run SMQ230 LEAD FREE paste.. its liquidous at 217C..the oven have 7 zone, but I run in 5 zones also with a more agressive profile (due to the line rate)..I would like to know if runn
Electronics Forum | Mon Feb 19 08:00:46 EST 2007 | ck_the_flip
Darby, thanks for the good info. I actually read an article is Circuits Ass'y that a more rapid cooling rate results in "better diffused tin rich clusters" resulting in better grain structure. But...this article was written by an Oven manfuacturer
Electronics Forum | Fri Feb 23 08:51:38 EST 2007 | dekhead
Are you saying that it works in "no fmi" mode, but not in manual? Please tell me how it works in both. I'm asking you to change things to ascertain the problem, not as possible solution... if you can't get the board to stop in the correct position,
Electronics Forum | Fri Mar 23 18:55:27 EDT 2007 | peter
I am wondering if anyone has experience using Siemens SiplacePro OIS software for machine data? If so, what types of information: placement rate, defects, runtime, etc?? Any application information would be very valuable. Of course we asked Siemens
Electronics Forum | Fri Apr 27 11:47:28 EDT 2007 | BKG
We are looking at obtaining a TP9-UFP and I have never worked on mydata before. Most of my experience is on Philips and QUAD. Opinions on practicallity for low volume high mix application? What is the actual CPH? I see it is rated at 6000cph, but in
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