Electronics Forum | Mon Jan 24 22:28:57 EST 2005 | davef
In addition to the potential problems you mentioned, add: * Barrel cracking of PTH and via. * Lifted pads. * Warped boards. And the reason you're not using a solder fountain to to solder this connector is? Or use an old trick we've done here on SMT
Electronics Forum | Fri Jan 28 12:29:01 EST 2005 | Bob R.
We use the exact same method Chunks outlined for evaluating just about anything we're going to roll out worldwide, whether it's a material or a machine. List your factors (print speed, solder spread, etc), assign each a weight, evaluate each paste a
Electronics Forum | Thu Feb 10 14:27:07 EST 2005 | cyber_wolf
First of all, whom are you getting it from ? Mydata, or a used equipment broker. If you can tell me what machine type you are looking at, then I can tell you what to look for. (MY-series, or TP series) Most important things right off the bat: *Machi
Electronics Forum | Mon Jan 31 11:34:58 EST 2005 | Chunks
Testing vias may be acceptable, but not preferred. If you do test by via, it�s a last resort type of thing. Vias are always a pain in the real world. Generally, they are soldered by wave, so they aren�t always doomed correctly, plus residue build-
Electronics Forum | Mon Jan 31 13:38:17 EST 2005 | mrclean
This build up is likely related to the defoamer. Defoamers are typically based on waxes and/or high molecular weight Hydrocarbons. As defoamers only need to work on the exposed fluid surface, not a lot of defoamer is needed (unless you are using
Electronics Forum | Mon Jan 31 15:02:52 EST 2005 | gs
First of all ask your Suplliers to provide you SMD in Tape & reel, second point, you can ask Service for Tape & Reel or in case components are not so many, you could asses ef convenient to buy a sinple maual Tape & Ree machine and do it inside your f
Electronics Forum | Tue Feb 01 11:34:55 EST 2005 | Dougs
Has anyone heard of any software that can be used to clean up or manipulate x-y placement data. We are a small contract manufacturer with various customers, some who supply good x-y data to component centres and some who supply x-y data to a pin or
Electronics Forum | Wed Jul 06 09:51:23 EDT 2005 | Jack
Doug, It always seems easier to fix one or two problems by eye at the time. The real problem comes when the customer wants the same board run again later. You're okay if you saved the corrected placement routine, but if you end up moving the job t
Electronics Forum | Tue Feb 01 15:54:53 EST 2005 | jbrower
Hi George, The simple answer is that if you're company only does business in the US, or South america or Antartica or any where else that you aren't frozen out due to RoHS and the WEEE directives, then going lead free may not make sense. Unless your
Electronics Forum | Wed Feb 02 13:05:51 EST 2005 | russ
Process flow 1.Remove part - It may be necessary to bake assembly prior to removing. 2.Remove remaining solder from part 3.Apply flux to part 4.Apply solder spheres to part 5.Reflow part You may want to bake component before re-installing 6.Apply
