Electronics Forum: viewing (Page 6798 of 7890)

Lead-Free SMD repair

Electronics Forum | Fri Apr 29 07:29:58 EDT 2005 | siverts

Steve, Thanks for Your replay and I agree with You. But sometimes I find it hard to always have the optimum in every aspect of our high mix/low volume electronics assembly production. We also do a lot of prototype production. In this case we had to g

Lead-Free SMD repair

Electronics Forum | Sat Apr 30 10:37:25 EDT 2005 | Daniel

I think he did mentioned the board size in the inital thread: "265mm x 207mm pcb", but maybe it was not clear written. I have a question about rework and pre-heat: is it necessary to have the pre-heater to cover the whole board size, even if you onl

Lead-Free SMD repair

Electronics Forum | Sat Apr 30 13:56:31 EDT 2005 | steve

My experience with different size boards and pre-heaters. The perfect world (right?) you would saturate the complete pcb with bottom pre-heat. But it is difficult with repair and rework equipment, not to mention the expense and foot print of large pr

Lead-Free SMD repair

Electronics Forum | Fri May 20 14:43:38 EDT 2005 | jfullerton

billscheu wrote: "just use 63 37 solder for repair. I do not know of any specification which prohibits this and until the people who create the rules change them this is the best." All due respect, but do you know what RoHS is? If you sell product i

Problems with .45 mil ball diameter BGA....

Electronics Forum | Tue Apr 26 16:00:08 EDT 2005 | jdumont

Good day all, we are having problems with some new BGAs that are slowly filtering their way into our designs. Engineering really wants to use them and I am pressured to make them work. They are 54 ball BGAs. The pitch is .8 mils and the ball diameter

Problems with .45 mil ball diameter BGA....

Electronics Forum | Wed Apr 27 02:22:08 EDT 2005 | grantp

Hi, There are a number of things you can try. You are already using 1:1 hole to pad ratio, and that's good as you need the size. I would try an electroform stencil as that will have a smooth side of the aperture and help paste release. Don't use c

Problems with .45 mil ball diameter BGA....

Electronics Forum | Fri Apr 29 17:49:22 EDT 2005 | Woodsmt

I have used many of these devices recently and have used them several times over the last few years. I have been successful using a type 4 paste on a 5 mil stencil. The 13 mil round aperture should provide you with an area ratio just adequate for r

Problems with .45 mil ball diameter BGA....

Electronics Forum | Fri Apr 29 17:49:26 EDT 2005 | Woodsmt

I have used many of these devices recently and have used them several times over the last few years. I have been successful using a type 4 paste on a 5 mil stencil. The 13 mil round aperture should provide you with an area ratio just adequate for r

Flux residual on joints of PIH

Electronics Forum | Wed Apr 27 10:52:52 EDT 2005 | saragorcos

Have you examined what type of residue is present? It is possible that what you are seeing is benign, though flux that is not fully activated often leaves harmful residue species such as chloride or weak organic acids. If you don't want to change p

MYDATA vs ASSEMBLEON

Electronics Forum | Tue May 03 04:13:07 EDT 2005 | Rob

No offence, but the Universal platform is hardly in the same league in terms of user friendlyness & ease of working on than a Mydata. However it does murder the Mydata in terms of accuracy, repeatability, longevity etc. & the Lightning head leaves


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