Electronics Forum | Mon Oct 09 14:30:44 EDT 2006 | Brian
I agree with Chunks. Programming was much simpler. The 2D inspection is much better on MPM. I didn't have to use offsets on the MPM or the DEK very often, but did more on teh DEK. I didn't like the front justified stencils on the DEK. I also did
Electronics Forum | Thu Oct 05 16:04:00 EDT 2006 | GS
I am not expert, just my comment, the total ionic contamination allowed after SMT, by using No Clean process, theoretically it should be close to Zero. Any way the Standard IPC-JSTD-001 allows 1,56 ugr NaCl/cm2 for the final Printed Board assembled.
Electronics Forum | Thu Oct 05 10:37:10 EDT 2006 | David
Hello all, We have problem with voids in one of our product. We are soldering IC (package SO8) with under the components grounding connection. The ground pad for this component has 3 via holes (before producing we have to cover this 3 holes from b
Electronics Forum | Thu Oct 05 11:40:49 EDT 2006 | Mario Scalzo, SMT CPE
David, We have seeing this more and more in the recent weeks. In a nut shell, yes; we believe that the voids that you are seeing are from the trapped air in the via from printing over it. If you could remove the Kapton tape, this might help. Also
Electronics Forum | Thu Oct 05 15:41:36 EDT 2006 | Mario Scalzo, SMT CPE
Good afternoon. From what it sounds like is that the solder joins are not getting hot enough or if it Au, then the increase in the Au content of the joint is increasing the melting point of the final solder joint. To some extent, this will also hap
Electronics Forum | Sun Oct 08 12:00:11 EDT 2006 | grantp
Hi, Just a hint to help your posts. When posting a new thread, try and put something into the subject line that helps people know what the post is about. I think the subject is like a little advertisement for your post to encourage people to click o
Electronics Forum | Tue Oct 10 11:06:04 EDT 2006 | lheiss
Hi All, I wasn't sure how this would turn out until I ran some production. As I suspected, after every nozzle change the machine dumps the first 3 pickups, checks the nozzle height again (function 30?) and then begins placing with correction with n
Electronics Forum | Wed Oct 11 09:53:06 EDT 2006 | Rob
Yes, kind of - I had a look through my notes from a while back where we did a lot of work on bending strenght but the only original source I could find was reference to a paper drawn up in 1979 "Increase Terminal to Pad-Peel Strength with a Standard
Electronics Forum | Tue Oct 10 16:04:45 EDT 2006 | slthomas
*and* board repair, does anyone know where I can get (optimum resolution) an economical repair on an ICOS MVS 100/32 vision card, or (next best thing) a schematic for it? Tyco can't provide a schematic because they don't have one (proprietary techno
Electronics Forum | Tue Oct 17 03:13:10 EDT 2006 | charless
Apoligies Steve if I did not explain myself clearly. We have made the same design using the same RoHs compliant components (which I am assured by the suppliers are process temperature capable) with both lead and lead free solder. Without wishing to
