Electronics Forum: /09 (Page 689 of 1633)

Nickel Silver Reflow process

Electronics Forum | Thu Feb 14 09:41:03 EST 2013 | davef

Look here http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=64413 BR, davef

JT reflow ovens

Electronics Forum | Thu Feb 14 09:48:59 EST 2013 | cyber_wolf

Does anyone have any experience with JT reflow ovens ? If so any feedback would be much appreciated. Thanks!

Nano coatings ?

Electronics Forum | Mon Feb 25 09:43:19 EST 2013 | davef

Señor Tech: You're correct. I get the impression that these coatings are aimed at solving specific problems. If you don't have that kind of pain, why get involved?

FUJI CCIMF

Electronics Forum | Sat Mar 09 07:37:32 EST 2013 | mdang

Hi, Does anyone have specification or document describe CCIMF file format? Is this proprietary spec or open document? Thanks, -Michael

Mirtec Programming Discussion

Electronics Forum | Tue Apr 09 12:08:25 EDT 2013 | zinalnpatel

I am new into the programming of mirtec MV2-HT and I have tried a lot of things tyo program for the IC bridge inspector but it fails everytime, Can someone please help me learn the programming of IC bridge. Thank you

Conformal Coating Masking

Electronics Forum | Wed Mar 20 09:54:11 EDT 2013 | patrickbruneel

Seal and peel would be the solution to your curing time problem. It’s a thermoplastic hot melt which air cures as quick as 30 seconds. http://www.interfluxusa.com/Datasheets-PDF/Seal-and-Peel-(DSRev08).pdf

Solder Pot Draining

Electronics Forum | Thu Sep 19 17:31:53 EDT 2013 | barry g

Hi, we are going to be doing the same here next week. Did u have to put anything in the pans, paraffin wax or such to prevent sticking to pans?

Solder Pot Draining

Electronics Forum | Fri Sep 20 08:34:30 EDT 2013 | island2013

We've done the same as what Woodsmt has suggested. Bread pans and a ladle. Slow going but safe. We did not have to add anything to the pans to prevent sticking. Woodsmt, did you have to worry about the pot heaters over heating while draining?

Pb Free BGA Backward Compatibility

Electronics Forum | Sun Mar 31 00:42:09 EDT 2013 | dhanish

Why we cannot run Pb Free BGA with Sn/Pb process but we can run high temp BGA(90/10) with Sn/Pb? Both require high temperature to form the IMC.Why there is a difference in the reliability?

Yamaha/Philips/Assembleon

Electronics Forum | Wed Apr 10 09:16:29 EDT 2013 | fredcalkins

You also might find this old thread useful: http://www.smtnet.com/forums/index.cfm?fuseaction=view_thread&CFapp=1&Thread_id=8894&mc=11


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