Electronics Forum | Thu Feb 01 16:33:57 EST 2007 | mika
The reject rate of yours could be a number of reasons. 1. Which component types are rejected? 2. From a particular nozzle? 3. If the rejected part will be dropped on the reject belt or reject bin; it suggests that there is a problem with the componen
Electronics Forum | Mon Jan 29 15:21:56 EST 2007 | flipit
If you teach your feeders, you can no longer gang pick correct? I have never had a dual beam or dual head GSM before. However, if you teach feeders with the fiducial camera and your picks are still off, there is an offset in one or several spindles
Electronics Forum | Mon Jan 29 10:11:12 EST 2007 | muse95
What does your customer want you to do? I would not want a CM soldering one of my boards with leadfree paste if I didn't ask him to. Whatever you do, get approval first. Two things to consider: If the other components are not rated for leadfree tem
Electronics Forum | Wed Jan 31 09:54:52 EST 2007 | FredC
Rob, I am not a Fuji technician, but I have some knowledge on the nozzles, windmills, and headshafts. As far as I know the bore the nozzle travels in should be dry with no lube. The grease on the windmill shaft and locating pin is a special purpose g
Electronics Forum | Tue Jan 30 17:58:49 EST 2007 | flipit
Hi, I would not be too concerned about what the shape of your wirebonding fiducial is. Cross, Square, Diamond, Circle, will all work well for you. I use a "+" and a diamond. Your machine magnification will be great, so don't make the fiducials to
Electronics Forum | Wed Jan 31 17:30:54 EST 2007 | GS
Thanks a lot flipit, I am not directly involved in this "problem" but is my friend that have his CM rejecting PCBs because it says the "+" mark (spokes lengths) are out of tolerances. It seams CM bonder's require tolerance +/- 0,05(? not sure). I d
Electronics Forum | Tue Jan 30 12:16:47 EST 2007 | pbarton
We are seeing unusual soldered joints when soldering to components with Pt/Ag metallised terminations. At the margin between the bottom of the component termination and the PCB surface there are a number of blowholes in the bulk solder. There also ap
Electronics Forum | Tue Jan 30 12:58:49 EST 2007 | barryg
We are seeing problems with platinum over silver plated part also. Our main problem is solder splatter under these devices, and voiding at the terminations on parts off the reels.I am curious if you have removed any of these parts and noticed any spl
Electronics Forum | Mon Feb 12 12:33:24 EST 2007 | SJ
There are several ways to inspect solder paste after deposition. Defects will range - too much paste, not enough, misaligned, bridged, smeared, etc. Some sceen printers have 2D inspection imbedded, otherwise a standalone system for paste inspection
Electronics Forum | Fri Mar 02 10:06:28 EST 2007 | oldsmtdude
Agilent SP50 rocks for continuous improvement and pass-fail efforts. You'll see variation you never imagined you had prior. But be aware you absolutely have to monitor data and tweak your processes to improve results. Do not jump in and try and use
