Electronics Forum | Thu Apr 19 23:53:32 EDT 2007 | Haris
NOTE: VIOS format takes less memory than XML format. VIOS to XML on YV100Xg Click EDITOR button. VIOS data appears, click your desired file name then click PCB DATA in the menu and click SAVE PCB DATA OF XML AS, give name with the extension .xml MY
Electronics Forum | Wed Apr 18 09:16:51 EDT 2007 | Cecil
We currently have an assembly that we have to mask the surface of several (24)SMT components where thermal compound is applied at a latter operation. These component packages vary from BGA's to QFP's. After the thermal compound is applied the PWA is
Electronics Forum | Wed Apr 18 16:41:43 EDT 2007 | patrickbruneel
Look at page 8 paragraph 22 This exempt was approved by the TAC June 22, 2006 http://www.emsnow.com/cnt/files/white%20papers/Status_of_EU_RoHS_Exemptions.pdf The exempt was granted by request from both Swatch and Sony for tin whisker formation on
Electronics Forum | Mon Apr 23 15:44:31 EDT 2007 | flipit
Steve, You read it the same way I read it. Some of my coworkers thought that the 600 micron and under spec meant that you could use lead solder and be exempt at this component pitch. That is why I posted it on SMTNET. The exemption specifically s
Electronics Forum | Tue Apr 24 09:51:18 EDT 2007 | slthomas
Patrick, firstly, I don't disagree with you on the efficacy of or lack of good science behind RoHS. It's a bad joke and our industry is the victim that got punked. I simply don't see anywhere in that document that states they've got an exemption tha
Electronics Forum | Wed Apr 25 10:45:25 EDT 2007 | slthomas
I read the request months ago with great interest. However, a request is hardly an exemption. Here's my issue with the language: "23. Lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with NiFe lead fra
Electronics Forum | Wed Apr 25 15:19:15 EDT 2007 | flipit
Steve, See the link below. See the out take from the link below. http://forum.europa.eu.int/Public/irc/env/rohs/library?l=/requests_exemptions/resistant_applications/hpdoc/_EN_1.0_&a=d The specific verbiage is, "This exemption request seeks to
Electronics Forum | Fri Apr 20 15:49:26 EDT 2007 | Theresa Spear
Instead of using adhesives to glue the back side SMD components and wave soldering them together with the through hole components, our manufacturing engineers choose to process the back side components through reflow oven without adhesives and proces
Electronics Forum | Mon Apr 23 09:49:57 EDT 2007 | realchunks
Hi T, Gluing parts to the back side for wave solder is a widely used process. Running waves pallets is probably the last way I would want to run a wave. There are just so many things that have to be done to assure good quality first time pass, tha
Electronics Forum | Mon Apr 23 10:11:11 EDT 2007 | grayman
Glue application is widely used in my country.However, some companies want to save cost and remove the glue application. We are also using fixture to cover some components. It has no problem. Please try cleaning your fixture by alcohol or water.Brush
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