Electronics Forum | Tue Mar 27 01:52:23 EDT 2018 | buckcho
Hello Diego, are the components missing on the first side or the second side. Like Mr. Evtimov said, you can check before the oven the pcbs's visually and see what happens after the oven. In this way you can see if it is the oven for sure. Then there
Electronics Forum | Tue Feb 11 13:22:22 EST 2020 | rgduval
Sebas, I suspect that your finding of needing the fillet for the card to work is a false finding. One that I dealt with for many years in assembly. As a bottom terminated device, a fillet to the side terminals of the device is not required. Adequ
Electronics Forum | Mon Apr 19 15:45:21 EDT 2010 | dwonch
Thanks to all for your input. We did have a third party do an analysis on boards from the first shop. They were shipped directly from the board shop to eliminate the possibility that we could contaminate them. The third party (Forsite) did find Sili
Electronics Forum | Mon Apr 03 01:35:31 EDT 2006 | darby
I have a less than perfectly designed pcb requiring double sided lead free reflow. Several components from either side will detatch using the standard process. If I was using Sn63Pb37 I would just dispense some adhesive after paste and cure at the r
Electronics Forum | Mon Oct 19 17:40:01 EDT 1998 | Eric
Nate, If your stencil vendor has laser-cutting capabilities, they should be able to burn in your fiducial locations. This process involves re-setting the focus of the laser beam to burn the locations 1-3 mils into the surface (as opposed to 1/2 cut
Electronics Forum | Fri Jun 12 11:15:50 EDT 1998 | Ryan Jennens
Hey all! The wave solder warrior is back. I have found a flux which leave almost no residue (the least yet), but because of its super low solids content I absolutely cannot get topside fillets. The multi-layer, two sided board is on a pallet w
Electronics Forum | Sun Jun 07 06:05:37 EDT 1998 | Bob Willis
| Can anyone tell me if there is a reference for smt component height specs on the bottom side of a board, which will also go through wave soldering. A current design I am reviewing has tant caps(7343) and a crystal on the back side. Should I only b
Electronics Forum | Fri Jun 21 16:41:10 EDT 2002 | pjc
If your wave machine has the new style Rotary Chip Wave and the Hot Air De-Bridging Knife options you can expect good yields. However, depending on the PCB design, double-sided solderpaste reflow and selective solder pallets for wave solder is a bett
Electronics Forum | Wed Apr 28 13:33:48 EDT 2004 | Rob
Thanks to all. The way I've been doing it has been crude and very similar to your method. I make an imprint of the bottom side and cut out areas where components sit and this imprint transfers over to a cardboard. When it comes time to run the second
Electronics Forum | Tue Jun 19 19:03:31 EDT 2007 | diesel_1t
Hi folks. If the solder is on the BGA but is not soldered at all on the pads, then you can discard BGA solder issues, by the other hand; you might be experiencing wicking due to heat is being absorbed on component so the balls on BGA are hotter than
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