Electronics Forum: after (Page 70 of 698)

Thousands of TSOP or VSOP To be replaced after assembly

Electronics Forum | Wed Mar 20 17:18:08 EST 2002 | alex_kirichenko

Hello everyone!! About hot air tool.... Most of the the brands will supply you with specific nozzel for the package to be removed, it will heat up leads only, so you don't have to mask anything (sounds like less work :) ) by the way I had to take

Gold surface contam after prebake 150C for 3 hrs

Electronics Forum | Wed Apr 07 10:10:00 EDT 2004 | ccl

thanks Dave, solder mask use is AUS 5 from Taiyo ink, solderability of the contam area is still pass the min spec. gold thickness is ~ 1 um and Ni layer is ~10um. can solder mask bleed cause contam? forget to tell the product is full body gold (FBG)

Urgent!! ... AI process after SMD Reflow Soldering

Electronics Forum | Thu Sep 15 08:33:14 EDT 2005 | pjc

Is not a problem, I've done it. Be sure the insertion tooling and cut&clinch tooling are set to proper distances from the board. If proper, no deflection of PCBA should be observered during AI. Obviously, your AI Operator must be more careful with PC

Urgent!! ... AI process after SMD Reflow Soldering

Electronics Forum | Thu Sep 15 10:00:28 EDT 2005 | slthomas

I'm curious about one thing. What kind of components are on the bottom, how many are there, and how are you processing (in particular how do you get glue and paste on) them? Edited to add: You shouldn't have any problems (assuming your tooling heigh

Urgent!! ... AI process after SMD Reflow Soldering

Electronics Forum | Thu Sep 15 11:16:20 EDT 2005 | pjc

Thanks Steve, good point about warped boards, which are common with doube-sided reflow. Centerboard support helps minimize on reflow. We did do modification to the workboard holders to ensure boards are secured. The boards where small enough that war

Use of solder paste after taking out from cold storage

Electronics Forum | Sat Nov 05 05:09:51 EST 2005 | ajay

we do keep out solder paste ready for next shift or for replenish. We specified a location to keep new paste ( only one container ) near stencil machine. As soon as that is use we put another container from freeze, we make sure that at specified loca

Use of solder paste after taking out from cold storage

Electronics Forum | Fri Nov 18 07:22:35 EST 2005 | avalancher

Moonman really needs to stop. I finally looked at his site, and it sucks. It is NOT informative, he has chosen horrible background and font colors (immediately got a headache). It is just some 'person' who thinks 'he/she' is an expert in this indust

Use of solder paste after taking out from cold storage

Electronics Forum | Mon Nov 21 17:55:19 EST 2005 | slthomas

"...Moonman is a pretentious wannabe in the industry. If you look through the archives here you'll see that nothing could be further from the truth. His contributions on the past were pretty friggin' spot on. However, he no longer posts anything t

No solder and solder bridge after Wave solder machine

Electronics Forum | Thu Nov 17 03:34:51 EST 2005 | cangly

Hi, We have a board with over 100 chips (mixed size) and some long Connector DIP through out Wave solder with many issues of no solder and solder bridge, (using clean flux with bubble fluxer and Kester solder bar). Currently we tried to reduce the de

No solder and solder bridge after Wave solder machine

Electronics Forum | Thu Nov 17 08:57:39 EST 2005 | russ

No clean and foam fluxing is not a very good process from my experience. I know that the flux manufacturers claim that they are suitable but I am not sure what "suitable" means. I would bet that you have very inconsistant flux coverage. How often


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