Electronics Forum | Fri May 14 17:06:18 EDT 1999 | Ryan Jennens
| | Hi Guys, | | | | I am going to be graced with the good luck of processing microBGA's in the near future. A bit of a step forward from printing 20-mil pitch and wave soldering 0805's, wouldn't you say? | | | | So, any of you folks who have alre
Electronics Forum | Fri May 14 17:06:29 EDT 1999 | Ryan Jennens
| | Hi Guys, | | | | I am going to be graced with the good luck of processing microBGA's in the near future. A bit of a step forward from printing 20-mil pitch and wave soldering 0805's, wouldn't you say? | | | | So, any of you folks who have alre
Electronics Forum | Mon Nov 02 17:45:46 EST 1998 | ChrisK
In my experience, solder balls are normally caused by only a few things. In order of likelyhood: 1) Water based fluxes (VOC-Free)not having the water carrier completely dried from the board before going into the solder. I.E, too fast conveyor spee
Electronics Forum | Thu Sep 17 10:45:27 EDT 1998 | Justin Medernach
| We have problems with voids when we solder lids to | ceramic flatpackages. | The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel | The solder is attached to the lid (preform) and the solder material
Electronics Forum | Mon Sep 14 21:40:25 EDT 1998 | Stefan W.
Unfortunatly there are too many variables to play with that you can't make a general rule for the vibration time. However, I suggest you increase the vibration time and lower the vibration force ( AC voltage ). For an SO 8, I would use 600 ms for an
Electronics Forum | Tue Sep 15 14:12:36 EDT 1998 | Justin Medernach
| Unfortunatly there are too many variables to play with that you can't make a general rule for the vibration time. | However, I suggest you increase the vibration time and lower the vibration force ( AC voltage ). For an SO 8, I would use 600 ms for
Electronics Forum | Fri Sep 04 09:33:40 EDT 1998 | Stefan W.
| I need advice for locating 23 Gull wing LED's (all in a straight line) in the x,y, and z axis for a SMT PCB. It is a Hewlett Packard LED (P/N HMLA-QH00-01). The application uses a CCD to detect the position of a ball which floats in a resevior fo
Electronics Forum | Tue Jul 28 02:22:59 EDT 1998 | Bob Willis
Here is what I would do faced with your problem. First I would profile a similar board or use an existing profile. From there I would place the dummy device on the surface of a sample board with a thin thermocouple soldered to the board surface under
Electronics Forum | Fri Jun 19 10:03:46 EDT 1998 | Earl Moon
| Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | Mike Mike, We and ind
Electronics Forum | Wed Jun 03 07:02:25 EDT 1998 | Earl Moon
| Does anybody know if a contraption exists that will minimize a PCB's tendency to become slightly bent after reflow? We have a new product that we're planning to assemble in a couple of months. The board is 9.7" by 13.4" and it is imperitive that
