Electronics Forum | Thu Mar 13 15:17:03 EDT 2008 | slthomas
about WHY violating IPC design standards gives you grief? Do they even know they exist? We've got one in particular that seems to shoot from the hip. I want to tell them the "why" as well as the "what" so they'll be a little more proactive. My fee
Electronics Forum | Fri Sep 07 11:46:29 EDT 2018 | dleeper
Air gap on the PCB is determined the pad spacing which in turn is governed by the component. As long as the PCB designer is following the typical BGA layout best practices; i.e no open via in pad, non-solder mask defined pads, solder mask covered tra
Electronics Forum | Wed Apr 29 04:08:55 EDT 2020 | tomzhao2
PCB Electronics Ltd, a leading corporation focusing on one-stop service for PCB&PCBA ,has a management team of 15-year experience in EMS industry. Productivity: 2 layers to 32 layers, including HDI, flex-rigid boards etc. Application fields: C
Electronics Forum | Tue Feb 10 15:13:06 EST 2004 | patthemack
Hey Vinny, Sorry I haven't looked at this for a while. 3 things to try: Tombstoning- The ground plane side is larger because the solder mask allows for a little slop at the board shop (clearance around a pad of a few mils). Since there is not a defi
Electronics Forum | Thu Aug 19 19:04:55 EDT 1999 | Brian Wycoff
| | Can anyone help on the subject of de-wetting during the spray coating process. We use PC29M Parts A+B spray coating material, Humiseal tapes and masking dots, Marigold supertouch V70N gloves and Concoat CM533 liquid masking material. We also use
Electronics Forum | Thu Apr 22 20:26:39 EDT 1999 | Dave F
| | On various PCB's after building processes,such as reflow, flowsolder and wash. The soldermask on the PCB's have become discoloured, like a 'marble' effect all along the solder side of the board, it is lighter in contrast than normal, although whe
Electronics Forum | Fri Sep 15 12:30:05 EDT 2006 | Steve
If the package is robust enough to handle surface mount followed by a pass through the wave soldering process, we have had excellent results populating the fine pitch parts with the P&P machine, reflow, then mask the solder joints prior to wave solde
Electronics Forum | Mon Jul 06 17:42:49 EDT 1998 | Bruce Houghton
| I'm having a problem getting good reflow on gold sufaced boards. The profile looks good and I have adjusted it both hotter and colder and adjusted the various times ( soak, reflow ) to no avail. What realy gets me Is that a month ago we built some
Electronics Forum | Fri Apr 07 10:26:01 EDT 2000 | Ashok Dhawan
I have come across a number of cases where Solder Mask is chipped off or scratched. I was wondering this has anything to do with : **Packing of PCBs in stacks and vacuum sealed **Stacking of PCBs prior to print operation What is general practice i
Electronics Forum | Wed Feb 21 20:00:09 EST 2001 | davef
Sounds like you received some good advice. Most of our stencils are used once a day [at most], so more often than not they are air dried. If we goof-up and need to reuse a stencil during a day when we have limited drying capacity, we wipe the lowes
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