Electronics Forum | Sun Jul 08 06:38:41 EDT 2007 | dilogic
We have an old GSM1 (I-block, USOS V1.4.14, two 4-spindle heads, changers between rails). When I configure machine so there are no nozzles on heads and changers are filled with required nozzles, except for one empty hole, machine won't pick up nozzle
Electronics Forum | Mon Jul 09 11:19:07 EDT 2007 | swag
I could be wrong but I don't believe that you can start with any empty spindles. If it picks up nozzles, you will end up with more than one empty changer hole which will not work for the vacuum that is required to remove the nozzles from the spindle
Electronics Forum | Tue Jul 10 07:22:48 EDT 2007 | davef
Q1. Is kapton tape an industry accepted way of protecting gold pads from solder splashes? A1. No. It is more accepted to resolve the reason behind the solder splats, so that the added labor and cost of taping is eliminated. Search the fine SMTnet Arc
Electronics Forum | Tue Jul 10 19:16:08 EDT 2007 | 5why
We have filed returned (approx. 5%) of the boards that exhibit inner layer short @ a particular connector locations. X-section revealed there exhibit Cu residue, but aside from that, we also suspect there could be organic contaminant, what test shou
Electronics Forum | Mon Jul 16 16:39:17 EDT 2007 | davef
We doubt that entrapped process chemicals cause under-etch. Over-etch maybe, but not under-etch Under-etch is an indicator of improper process control/improper chemistry during etching. Under-etch can result in bridging between traces, resulting in
Electronics Forum | Wed Jul 11 14:45:22 EDT 2007 | samir
ECD, KIC, or any mfgr. of thermal profiling devices will charge a premium for "simple stuff". For example, ECD charges a grand for their "flux-o-meter", which is just a PCB with a hole pattern, a pallet, and pH-sensitive paper. You can easily ma
Electronics Forum | Mon Jul 16 15:44:27 EDT 2007 | davef
J-STD-001 doesn't necessarily require additional controls under conditions of low humidity, only that you verify the effectiveness of what you have in place. ESD S20.20 [1999] only says that relative humidity above 30% is "desirable". ESD S20.20 [200
Electronics Forum | Thu Jul 12 10:15:12 EDT 2007 | swag
I've got a proto build (3 boards) that has a Xilinx FG456 fine-pitch BGA on it. Every BGA pad on the PCB has an unmasked via attached. Between the via and the pad is a thin soldermask strip, maybe .005" wide at best. I am very confident it will br
Electronics Forum | Thu Jul 12 14:46:13 EDT 2007 | losersk8er
I'm new to the website so if I don't sound like I know what I'm talking about I probably don't. But I am having a great problem at work with conductive contamination that bridges two leads and shorts out the IC, causint costly repair. I have been t
Electronics Forum | Fri Jul 13 09:27:15 EDT 2007 | losersk8er
Sorry I have just started working in this industry so I am not as familiar with everything. The probelm is with the Product shorting because of small pieces of metal stretching accross two leads of an IC. This could be a result of faulty equipment?
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