Electronics Forum: electron (Page 6975 of 7890)

Micro Solder Balls in No Clean Selective Solder Process

Electronics Forum | Tue Jan 15 12:37:17 EST 2008 | gregoryyork

SORRY I did not offer a solution so here goes - The best way to get rid of this issue if you cant change flux is to reduce your flux consumption to a minimal with a spray flux and keep the heat REALLY high to boil off the alcohol before it can be abs

Micro Solder Balls in No Clean Selective Solder Process

Electronics Forum | Tue Jan 15 15:42:15 EST 2008 | ck_the_flip

Patrick, you're right. I've only dealt with 2 different flavors of Alpha alcohol-based flux. I've always thought that the convection causes the activator to evaporate more rapidly, but this is probably just the case with older formulations. Again,

Micro Solder Balls in No Clean Selective Solder Process

Electronics Forum | Tue Jan 15 16:44:54 EST 2008 | gregoryyork

I found some machine manufacturers put convection nozzles in line parallel with each other instead of staggering them so you get a nice parallel line up the board where there is no flux be it no residue alcohol or VOC Free. The best I could find was

Siemens waffle pack Changer problems _ Help Please!!

Electronics Forum | Sat Feb 09 09:39:11 EST 2008 | stockley

You have my sympathy, the Line computer Station configuration screen is hard to get your head around. Assuming that you have configured the station correctly you might need to re-compile the station and/or consistency check it to see of it passes.

Solder Tip Tinner

Electronics Forum | Tue Jan 15 21:44:05 EST 2008 | davef

We believe that tip tinners reduce the life of the tip, also. Why do you use such a product? We like using solder paste to clean solder tips. Place expired solder paste in a covered container. Open container and dip the tip. It comes out clean and s

XP242 MFU bypass

Electronics Forum | Thu Jan 10 15:06:50 EST 2008 | mmjm_1099

Hello all, Long time no talk. We just happen to pickup a XP242 the other month and like it so far. Well we have a question for you XP users or anyone that can help. There is a MFU on the XP and I was wondering when the operators pull it out for setup

Larger lands in corners

Electronics Forum | Mon Jan 14 22:52:48 EST 2008 | davef

Using larger pads on the corners is fairly common to improve self-alignment of BGA and CSP. For example, "9.3.2.8 Large corner pads and overprint The self-alignment of BGA or CSP can be improved through a design change. By utilizing a large board pad

Validation of Pick & Place programs

Electronics Forum | Fri Jan 11 16:05:46 EST 2008 | jlawson

Our programs are created in an ASCII format ( we > do not have Unicam or Circuit cam ), so we load > the finish PNP program and then we sort it by > reference designator. We then load the BOM in an > ASCII format and also sort it by reference >

Affordable Inspection Microscopes?

Electronics Forum | Tue Jan 15 09:20:26 EST 2008 | rgduval

I just got a scope off of Ebay from Precision World. There have been some kinks, but, overall, it was a good experience. The scope I picked up actually zoomed a little too much for our needs (I need to use it for assembly, as well as inspection).

Affordable Inspection Microscopes?

Electronics Forum | Tue Jan 15 15:53:14 EST 2008 | jmelson

I only build my own products, so it has to meet my needs for QA only. I am doing some 20 mil lead pitch (0.5mm) and will soon be doing a 0.4 mm pitch part. I have more magnification on my microscopes (40X) but almost never need to go that high. If


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