Electronics Forum | Fri May 21 09:08:58 EDT 2010 | rway
We recently received in a reel of a QFP-64 TI processors. TI has such a great lead time right now, we were forced to find these parts where we could. Unfortunately you are forced to deal with less than reputable people. So these parts did not come
Electronics Forum | Wed May 19 16:02:32 EDT 2010 | remullis
I am currently experiencing major issues when printing fine pitch parts. Pad width is .008 Even starting with a new screen, fresh paste, etc. I see where the paste is not breaking away from the screen apts consistently and when inspecting the pads I
Electronics Forum | Wed May 19 17:43:25 EDT 2010 | pforister
Hello, I'm having problems with voiding on an assembly that has a GPS hybrid with balls much like a BGA. This is a RoHS assembly using no-clean solder (Kester EM907). The voids are at or above 25%. I use an 8 zone oven where I peak in zone 7 and
Electronics Forum | Fri Jun 04 01:13:31 EDT 2010 | boardhouse
Hi fotis, Big difference between Cem3 & FR4 is that FR4 the glass is woven and Cem3 is sheet glass non-woven. for Multi layer product, i would not consider Cem3 due to increase chance of de-lam due to lack of weave for strength. Cem1 and Cem3 are
Electronics Forum | Thu May 27 18:40:02 EDT 2010 | dcell_1t
Hi. I'm trying to develop a shape to place a QFN at a CP6, I'm using FujiFlexa. We have never had a shape for this particular component, we only draw as a rectangle and put a rectangle vision No (10 in this case) but we're scarifying accuracy. is th
Electronics Forum | Sat Jul 03 15:14:25 EDT 2010 | scsi
Hege, can you share more info on the formulation you ended up using for the micro dot dispensing? I'm trying to find the proper metal load and viscosity for the auger valve dispenser that we are developing and it looks like the regular low viscosity
Electronics Forum | Fri Jun 04 21:27:16 EDT 2010 | deanm
We have a 4 zone Quad ZCR 531B reflow oven with top side heaters only and a mesh belt. Our boards are 2-6 layer, range in size from 2x2 to 7x15, 0402 to D2PAK. What are the limitations/drawbacks of having top side only heat, especially since about ha
Electronics Forum | Tue Jun 08 17:31:15 EDT 2010 | whitewing
For protos and very short runs I already use a polyester stencil + pizza oven process which is fine except for the placement time and tedium. I'm partly trying to bridge the gap between that and stuff that needs subbing out due to quantity, and partl
Electronics Forum | Sun Jun 13 10:53:20 EDT 2010 | bderks
Thank you all for responding, Pyropel might indeed be adequate and still cheap enough. Someone advised me aerogel, but we certainly can't afford that ;-) I've contacted WWW.rubber.com as well, but I'm still waiting for a reply. Why reinvent the w
Electronics Forum | Mon Jun 07 17:36:19 EDT 2010 | vmorina
Greetings SMT folks, My name is Danny, I am looking to purchase a low-medium/prototype reflow soldering machine. I would like to have your opinions for which vendor I should go for and model. I have been looking at the convection heating reflow sold
